Koupit ICL222R508-01 s BYCHPS
Koupit se zárukou
ICL222R508-01
- Part Number:
- ICL222R508-01
- Popis:
- ICL 2.5 OHM 20% 8A 22MM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15622 Pieces
- Datový list:
- 1.ICL222R508-01.pdf2.ICL222R508-01.pdf
Úvod
BYCHIPS je distribuční odrůda pro ICL222R508-01, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ICL222R508-01 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±20% |
|---|---|
| Série: | - |
| R Aktuální: | 0.06 Ohm |
| R 25 ° C: | 2.5 Ohm |
| Obal: | Bulk |
| Ostatní jména: | 480-3175 ICL222R50801 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | ICL222R508-01 |
| Rozestup vývodù: | 0.310" (7.87mm) |
| Rozšířený popis: | Inrush Current Limiter 2.5 Ohm Ohm ±20% 0.866" (22mm) |
| Průměr: | 0.866" (22mm) |
| Popis: | ICL 2.5 OHM 20% 8A 22MM |
| Proud - Steady State Max: | 8A |
| schválení: | - |
| Email: | [email protected] |
Související díly pro ICL222R508-01
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ICL222R515-01 | Honeywell Sensing and Productivity Solutions | ICL 2.5 OHM 20% 15A 22MM | Dotaz |
 |
SG326 | Ametherm | ICL 0.5 OHM 20% 30A 31.8MM | Dotaz |
 |
ICL222R018-01 | Honeywell Sensing and Productivity Solutions | ICL 2 OHM 20% 18A 22MM | Dotaz |
 |
ICL2210008-01 | Honeywell Sensing and Productivity Solutions | ICL 10 OHM 20% 8A 22MM | Dotaz |
 |
B57213P709M301 | EPCOS (TDK) | ICL 7 OHM 20% 5A 14.5MM | Dotaz |
 |
SL22 2R018-B | Ametherm | ICL 2 OHM 20% 18A 22MM | Dotaz |
 |
SL15 60004-A | Ametherm | ICL 60 OHM 20% 4A 16MM | Dotaz |
|
ICL227R010-01 | Honeywell Sensing and Productivity Solutions | ICL 7 OHM 20% 10A 22MM | Dotaz |
|
ICL221R020-01 | Honeywell Sensing and Productivity Solutions | ICL 1 OHM 20% 20A 22MM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers