Koupit HPND-4005 s BYCHPS
Koupit se zárukou
HPND-4005
- Part Number:
- HPND-4005
- Popis:
- DIODE PIN BEAM LEAD 120V
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18758 Pieces
- Datový list:
- HPND-4005.pdf
Úvod
BYCHIPS je distribuční odrůda pro HPND-4005, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu HPND-4005 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Peak Reverse (Max): | 120V |
|---|---|
| Dodavatel zařízení Package: | - |
| Série: | - |
| Odpor při IF, F: | 6.5 Ohm @ 20mA, 100MHz |
| Ztráta energie (Max): | 250mW |
| Obal: | Bulk |
| Paket / krabice: | 2-SMD, Beam Lead |
| Ostatní jména: | 516-2112 HPND4005 |
| Provozní teplota: | -65°C ~ 175°C (TJ) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 14 Weeks |
| Výrobní číslo výrobce: | HPND-4005 |
| Rozšířený popis: | RF Diode PIN - Single 120V 250mW |
| Diode Type: | PIN - Single |
| Popis: | DIODE PIN BEAM LEAD 120V |
| Proud - Max: | - |
| Kapacitní @ Vr, F: | 0.02pF @ 10V, 10GHz |
| Email: | [email protected] |
Související díly pro HPND-4005
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
HPND-0002 | Broadcom Limited | IC RF PIN DIODE CHIP SS HYBRID | Dotaz |
|
HSMP-3812-BLKG | Broadcom Limited | DIODE PIN ATTENUATOR SER SOT23-3 | Dotaz |
 |
HPND-4028 | Broadcom Limited | IC RF PIN DIODE BEAM LEAD SW | Dotaz |
 |
SMS3925-040LF | Skyworks Solutions Inc. | DIODE SCHOTTKY 50MA | Dotaz |
|
HPND-4038 | Broadcom Limited | IC RF PIN DIODE BEAM LEAD SW | Dotaz |
 |
BAP63-03,115 | NXP USA Inc. | DIODE PIN 50V 100MA SOD-323 | Dotaz |
 |
MA2SP0600L | Panasonic Electronic Components | DIODE PIN 60V 100MA SSMINI-2P | Dotaz |
 |
HSMP-389Y-BLKG | Broadcom Limited | DIODE PIN RF SWITCH 100V SOD-523 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers