Koupit GZC12103 s BYCHPS
Koupit se zárukou
GZC12103
- Part Number:
- GZC12103
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 9-120PF 100V THRU HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12146 Pieces
- Datový list:
- GZC12103.pdf
Úvod
BYCHIPS je distribuční odrůda pro GZC12103, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GZC12103 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 100V |
|---|---|
| Velikost / Rozměry: | 0.433" L x 0.374" W (11.00mm x 9.50mm) |
| Série: | FILMTRIM® |
| Obal: | Bulk |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GZC12103 |
| Výška - Sedící (Max): | 0.449" (11.40mm) |
| Funkce: | General Purpose |
| Rozšířený popis: | 9 ~ 120pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Popis: | CAP TRIM 9-120PF 100V THRU HOLE |
| Rozsah kapacitního: | 9 ~ 120pF |
| Typ úpravy: | Top and Bottom Adjustment |
| Email: | [email protected] |
Související díly pro GZC12103
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GZC12104 | Sprague-Goodman | CAP TRIM 9-120PF 100V THRU HOLE | Dotaz |
 |
GZC12100 | Sprague-Goodman | CAP TRIMMER 9-120PF 100V TH | Dotaz |
|
GNF8R000 | Sprague-Goodman | CAP TRIM 0.8-8PF 500V | Dotaz |
 |
CTZ3E-10A-W5-PF | AVX Corporation | CAP TRIMMER 2.5-10PF 25V SMD | Dotaz |
|
GXE10011 | Sprague-Goodman | CAP TRIM 1.8-10PF 300V THRU HOLE | Dotaz |
|
GKG70016 | Sprague-Goodman | CAP TRIMMER 15-70PF 100V TH | Dotaz |
|
GFP52000 | Sprague-Goodman | CAP TRIM 1-52PF 750V PNL MOUNT | Dotaz |
 |
GKY20066 | Sprague-Goodman | CAP TRIMMER 5-20PF 100V SMD | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers