Koupit GHW11000 s BYCHPS
Koupit se zárukou
GHW11000
- Part Number:
- GHW11000
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 0.8-11PF 750V PNL MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12617 Pieces
- Datový list:
- GHW11000.pdf
Úvod
BYCHIPS je distribuční odrůda pro GHW11000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GHW11000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 750V |
|---|---|
| Velikost / Rozměry: | 0.375" Dia x 0.578" L (9.52mm x 14.68mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | User Defined |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GHW11000 |
| Výška - Sedící (Max): | - |
| Funkce: | General Purpose |
| Rozšířený popis: | 0.8 ~ 11pF Trimmer Capacitor 750V Top Adjustment User Defined |
| Popis: | CAP TRIM 0.8-11PF 750V PNL MOUNT |
| Rozsah kapacitního: | 0.8 ~ 11pF |
| Typ úpravy: | Top Adjustment |
| Email: | [email protected] |
Související díly pro GHW11000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GKG10086-05 | Sprague-Goodman | CAP TRIMMER SMD | Dotaz |
 |
TZB4P400BA10R00 | Murata Electronics North America | CAP TRIMMER 8.5-40PF 100V SMD | Dotaz |
|
GUF1R200 | Sprague-Goodman | CAP TRIM 0.3-1.2PF 500V | Dotaz |
 |
GZC12100 | Sprague-Goodman | CAP TRIMMER 9-120PF 100V TH | Dotaz |
|
GGP30000 | Sprague-Goodman | CAP TRIMMER TH | Dotaz |
|
GFR36000 | Sprague-Goodman | CAP TRIMMER TH | Dotaz |
|
GEV28031 | Sprague-Goodman | CAP TRIM 1-28PF 1KV SURF MOUNT | Dotaz |
 |
0538-073-A-5.5-18 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Dotaz |
|
GNL2R500 | Sprague-Goodman | CAP TRIM 0.4-2.5PF 500V SURF MNT | Dotaz |
 |
GKY3R046 | Sprague-Goodman | CAP TRIMMER 1.5-3PF 100V SMD | Dotaz |
|
GMD40500 | Sprague-Goodman | CAP TRIM 75-380PF 175V THRU HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers