Koupit GHN5R500 s BYCHPS
Koupit se zárukou
GHN5R500
- Part Number:
- GHN5R500
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 0.8-5.5PF 750V T/H
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12137 Pieces
- Datový list:
- GHN5R500.pdf
Úvod
BYCHIPS je distribuční odrůda pro GHN5R500, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GHN5R500 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 750V |
|---|---|
| Velikost / Rozměry: | 0.312" Dia x 0.343" L (7.92mm x 8.71mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GHN5R500 |
| Výška - Sedící (Max): | - |
| Funkce: | General Purpose |
| Rozšířený popis: | 0.8 ~ 5.5pF Trimmer Capacitor 750V Side Adjustment Through Hole |
| Popis: | CAP TRIM 0.8-5.5PF 750V T/H |
| Rozsah kapacitního: | 0.8 ~ 5.5pF |
| Typ úpravy: | Side Adjustment |
| Email: | [email protected] |
Související díly pro GHN5R500
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GUV1R250 | Sprague-Goodman | CAP TRIM 0.3-1.2PF 500V SURF MNT | Dotaz |
 |
GKG5R015 | Sprague-Goodman | CAP TRIMMER 2-5PF 100V TH | Dotaz |
 |
BFC280823109 | Vishay BC Components | CAP TRIM 3-10PF 150V THRU HOLE | Dotaz |
|
GGV18000 | Sprague-Goodman | CAP TRIM 0.8-18PF 1.25KV T/H | Dotaz |
|
BFC280831659 | Vishay BC Components | CAP TRIM 5.5-65PF 150V THRU HOLE | Dotaz |
|
GHN5R531 | Sprague-Goodman | CAP TRIM 0.8-5.5PF 750V SURF MNT | Dotaz |
|
GXF15003 | Sprague-Goodman | CAP TRIM 2.5-15PF 200V THRU HOLE | Dotaz |
|
JFD-SP88GY | Sprague-Goodman | CAP TRIM 1-14, 2-7PF 500V PNL MN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers