Koupit GFV36031 s BYCHPS
Koupit se zárukou
GFV36031
- Part Number:
- GFV36031
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 1-36PF 1KV SURF MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14495 Pieces
- Datový list:
- GFV36031.pdf
Úvod
BYCHIPS je distribuční odrůda pro GFV36031, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GFV36031 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 1000V (1kV) |
|---|---|
| Velikost / Rozměry: | 0.312" Dia x 0.696" L (7.92mm x 17.70mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GFV36031 |
| Výška - Sedící (Max): | - |
| Funkce: | General Purpose |
| Rozšířený popis: | 1 ~ 36pF Trimmer Capacitor 1000V (1kV) Side Adjustment Surface Mount |
| Popis: | CAP TRIM 1-36PF 1KV SURF MOUNT |
| Rozsah kapacitního: | 1 ~ 36pF |
| Typ úpravy: | Side Adjustment |
| Email: | [email protected] |
Související díly pro GFV36031
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GFV36033 | Sprague-Goodman | CAP TRIM 1-36PF 1KV SURF MOUNT | Dotaz |
|
GFV36000 | Sprague-Goodman | CAP TRIM 1-36PF 1KV THRU HOLE | Dotaz |
 |
GZD12100 | Sprague-Goodman | CAP TRIMMER 9-120PF 100V TH | Dotaz |
 |
CV35A090 | Tusonix a Subsidiary of CTS Electronic Components | CAP TRIMMER 2.5-9PF 100V TH | Dotaz |
 |
SGNMNC1059EK | Sprague-Goodman | CAP TRIM 0.5 5PF 8.75KV CHAS MNT | Dotaz |
 |
TZC3P300A110R00 | Murata Electronics North America | CAP TRIMMER 6.5-30PF 100V SMD | Dotaz |
|
GKU10020 | Sprague-Goodman | CAP TRIM 4-10PF 250V THRU HOLE | Dotaz |
|
GMD40900 | Sprague-Goodman | CAP TRIM 215-790PF 175V T/H | Dotaz |
|
GZC15103 | Sprague-Goodman | CAP TRIM 10-150PF 100V THRU HOLE | Dotaz |
 |
BFC280801001 | Vishay BC Components | CAP TRIM 5.5-65PF 150V THRU HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog