Koupit GEV14000 s BYCHPS
Koupit se zárukou
GEV14000
- Part Number:
- GEV14000
- Výrobce:
- Sprague Goodman
- Popis:
- CAP TRIM 1-14PF 1KV THRU HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15374 Pieces
- Datový list:
- GEV14000.pdf
Úvod
BYCHIPS je distribuční odrůda pro GEV14000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GEV14000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 1000V (1kV) |
|---|---|
| Velikost / Rozměry: | 0.312" Dia x 0.484" L (7.92mm x 12.29mm) |
| Série: | - |
| Obal: | Bulk |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | GEV14000 |
| Výška - Sedící (Max): | - |
| Funkce: | General Purpose |
| Rozšířený popis: | 1 ~ 14pF Trimmer Capacitor 1000V (1kV) Side Adjustment Through Hole |
| Popis: | CAP TRIM 1-14PF 1KV THRU HOLE |
| Rozsah kapacitního: | 1 ~ 14pF |
| Typ úpravy: | Side Adjustment |
| Email: | [email protected] |
Související díly pro GEV14000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
GEV14031 | Sprague-Goodman | CAP TRIM 1-14PF 1KV SURF MOUNT | Dotaz |
 |
JR100 | Knowles Voltronics | CAP TRIMMER 2-10PF 100V SMD | Dotaz |
 |
BFC280851109 | Vishay BC Components | CAP TRIM 2-10PF 250V THRU HOLE | Dotaz |
 |
JZ100 | Knowles Voltronics | CAP TRIMMER 2-10PF 110V SMD | Dotaz |
 |
SGNMNC3153 | Sprague-Goodman | CAP TRIM 1.5-15PF 3KV CHASS MNT | Dotaz |
|
PC48H160 | Sprague-Goodman | QPL PISTONCAP TRIMMER CAPS | Dotaz |
 |
TZY2R200AC01R00 | Murata Electronics North America | CAP TRIMMER 4.5-20PF 25V TOP ADJ | Dotaz |
|
GZN20100 | Sprague-Goodman | CAP TRIM 9-200PF 150V THRU HOLE | Dotaz |
 |
SGNMNC1103K | Sprague-Goodman | CAP TRIM 1-10PF 3KV CHASS MNT | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers