Koupit GA100SICP12-227 s BYCHPS
Koupit se zárukou
GA100SICP12-227
- Part Number:
- GA100SICP12-227
- Výrobce:
- GeneSiC Semiconductor
- Popis:
- SIC CO-PACK SJT/RECT 100A 1.2KV
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13910 Pieces
- Datový list:
- GA100SICP12-227.pdf
Úvod
BYCHIPS je distribuční odrůda pro GA100SICP12-227, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu GA100SICP12-227 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | - |
|---|---|
| Napětí: | 1200V |
| Typ: | - |
| Série: | - |
| Paket / krabice: | SOT-227-4, miniBLOC |
| Ostatní jména: | 1242-1196 GA100SICP12227 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 18 Weeks |
| Výrobní číslo výrobce: | GA100SICP12-227 |
| Rozšířený popis: | Power Driver Module 1200V 100A SOT-227-4, miniBLOC |
| Popis: | SIC CO-PACK SJT/RECT 100A 1.2KV |
| Aktuální: | 100A |
| Konfigurace: | - |
| Email: | [email protected] |
Související díly pro GA100SICP12-227
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PM100CSD120 | Powerex Inc. | MOD IPM 6PAC 1200V 100A | Dotaz |
 |
FSB50325AS | Fairchild/ON Semiconductor | MODULE SPM 250V 1.7A SPM5P | Dotaz |
 |
PS22A72 | Powerex Inc. | MOD IPM 1200V 5A LARGE DIP | Dotaz |
 |
GA100SCPL12-227E | GeneSiC Semiconductor | SIC PHASE LEG BRIDGE 100A 1.2KV | Dotaz |
 |
GA100JT17-227 | GeneSiC Semiconductor | TRANS SJT 1700V 160A SOT227 | Dotaz |
 |
GA100JT12-227 | GeneSiC Semiconductor | TRANS SJT 1200V 160A SOT227 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers