Koupit FSB50550TB s BYCHPS
Koupit se zárukou
FSB50550TB
- Part Number:
- FSB50550TB
- Výrobce:
- Fairchild/ON Semiconductor
- Popis:
- MODULE SPM 500V 1.2A SPM23-AC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16726 Pieces
- Datový list:
- FSB50550TB.pdf
Úvod
BYCHIPS je distribuční odrůda pro FSB50550TB, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu FSB50550TB e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Izolace: | 1500Vrms |
|---|---|
| Napětí: | 500V |
| Typ: | MOSFET |
| Série: | SPM® |
| Paket / krabice: | 23-PowerDIP Module (0.748", 19.00mm) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | FSB50550TB |
| Rozšířený popis: | Power Driver Module MOSFET 3 Phase 500V 1.8A 23-PowerDIP Module (0.748", 19.00mm) |
| Popis: | MODULE SPM 500V 1.2A SPM23-AC |
| Aktuální: | 1.8A |
| Konfigurace: | 3 Phase |
| Email: | [email protected] |
Související díly pro FSB50550TB
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
FSB50550ASE | Fairchild/ON Semiconductor | MODULE SPM 500V 2A SPM5Q | Dotaz |
|
FSB50550BS | Fairchild/ON Semiconductor | POWER DRVR MOD 500V 3A 23SMD | Dotaz |
 |
FSB50550T | Fairchild/ON Semiconductor | IC SMART POWER MOD 3.5A SPM23-AC | Dotaz |
 |
FSB50550U | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM22-AD | Dotaz |
 |
FSB50550AB | Fairchild/ON Semiconductor | FET 3PH 500V 2A MODULE | Dotaz |
 |
FSB50550UTD | Fairchild/ON Semiconductor | MOD SPM 500V 2A SPM23-ED | Dotaz |
 |
FSB50550US | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM23 | Dotaz |
 |
FSB50550AS | Fairchild/ON Semiconductor | MODULE SPM 500V 2A SPM5Q | Dotaz |
 |
FSB50550A | Fairchild/ON Semiconductor | MODULE SPM 500V 2A SPM5P | Dotaz |
 |
FSB50550AT | Fairchild/ON Semiconductor | MODULE SPM 500V 2A SPM5N | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers