Koupit FK16X7R1H474K s BYCHPS
Koupit se zárukou
FK16X7R1H474K
- Part Number:
- FK16X7R1H474K
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 0.47UF 50V X7R RADIAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16726 Pieces
- Datový list:
- 1.FK16X7R1H474K.pdf2.FK16X7R1H474K.pdf
Úvod
BYCHIPS je distribuční odrůda pro FK16X7R1H474K, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu FK16X7R1H474K e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 50V |
|---|---|
| Tolerance: | ±10% |
| Tloušťka (Max): | - |
| teplotní koeficient: | X7R |
| Velikost / Rozměry: | 0.217" L x 0.138" W (5.50mm x 3.50mm) |
| Série: | FK |
| hodnocení: | - |
| Obal: | Bulk |
| Paket / krabice: | Radial |
| Ostatní jména: | 445-5329 FK16X7R1H474KN020 |
| Provozní teplota: | -55°C ~ 125°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 18 Weeks |
| Výrobní číslo výrobce: | FK16X7R1H474K |
| Lead Style: | Formed Leads - Kinked |
| Rozestup vývodù: | 0.098" (2.50mm) |
| Výška - Sedící (Max): | 0.236" (6.00mm) |
| Funkce: | - |
| Poruchovost: | - |
| Rozšířený popis: | 0.47µF ±10% 50V Ceramic Capacitor X7R Radial |
| Popis: | CAP CER 0.47UF 50V X7R RADIAL |
| kapacitní: | 0.47µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro FK16X7R1H474K
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
FK16X7R1E155K | TDK Corporation | CAP CER 1.5UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1E475K | TDK Corporation | CAP CER 4.7UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1E684K | TDK Corporation | CAP CER 0.68UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1E685K | TDK Corporation | CAP CER 6.8UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1C685K | TDK Corporation | CAP CER 6.8UF 16V X7R RADIAL | Dotaz |
|
FK16X7R1H684K | TDK Corporation | CAP CER 0.68UF 50V X7R RADIAL | Dotaz |
|
FK16X7R1C106K | TDK Corporation | CAP CER 10UF 16V X7R RADIAL | Dotaz |
|
FK16X7R1H225K | TDK Corporation | CAP CER 2.2UF 50V X7R RADIAL | Dotaz |
|
FK16X7R2A334K | TDK Corporation | CAP CER 0.33UF 100V X7R RADIAL | Dotaz |
|
FK16X7R1C475K | TDK Corporation | CAP CER 4.7UF 16V X7R RADIAL | Dotaz |
|
FK16X7R1C335K | TDK Corporation | CAP CER 3.3UF 16V X7R RADIAL | Dotaz |
|
FK16X7R1E106M | TDK Corporation | CAP CER 10UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1E106K | TDK Corporation | CAP CER 10UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1C106M | TDK Corporation | CAP CER 10UF 16V X7R RADIAL | Dotaz |
|
FK16X7R1E335K | TDK Corporation | CAP CER 3.3UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1H105K | TDK Corporation | CAP CER 1UF 50V X7R RADIAL | Dotaz |
|
FK16X7R1H155K | TDK Corporation | CAP CER 1.5UF 50V X7R RADIAL | Dotaz |
|
FK16X7R1E105K | TDK Corporation | CAP CER 1UF 25V X7R RADIAL | Dotaz |
|
FK16X7R1E225K | TDK Corporation | CAP CER 2.2UF 25V X7R RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers