Koupit FK11Y5V1H475Z s BYCHPS
Koupit se zárukou
FK11Y5V1H475Z
- Part Number:
- FK11Y5V1H475Z
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 4.7UF 50V Y5V RADIAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13515 Pieces
- Datový list:
- FK11Y5V1H475Z.pdf
Úvod
BYCHIPS je distribuční odrůda pro FK11Y5V1H475Z, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu FK11Y5V1H475Z e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 50V |
|---|---|
| Tolerance: | -20%, +80% |
| Tloušťka (Max): | - |
| teplotní koeficient: | Y5V (F) |
| Velikost / Rozměry: | 0.217" L x 0.157" W (5.50mm x 4.00mm) |
| Série: | FK |
| hodnocení: | - |
| Obal: | Bulk |
| Paket / krabice: | Radial |
| Ostatní jména: | 445-4823 |
| Provozní teplota: | -30°C ~ 85°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | FK11Y5V1H475Z |
| Lead Style: | Formed Leads - Kinked |
| Rozestup vývodù: | 0.098" (2.50mm) |
| Výška - Sedící (Max): | 0.276" (7.00mm) |
| Funkce: | - |
| Poruchovost: | - |
| Rozšířený popis: | 4.7µF -20%, +80% 50V Ceramic Capacitor Y5V (F) Radial |
| Popis: | CAP CER 4.7UF 50V Y5V RADIAL |
| kapacitní: | 4.7µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro FK11Y5V1H475Z
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
FK11Y5V1E226Z | TDK Corporation | CAP CER 22UF 25V Y5V RADIAL | Dotaz |
|
FK11Y5V1A476Z | TDK Corporation | CAP CER 47UF 10V Y5V RADIAL | Dotaz |
|
FK11Y5V1H106Z | TDK Corporation | CAP CER 10UF 50V Y5V RADIAL | Dotaz |
|
FK11Y5V1C226Z | TDK Corporation | CAP CER 22UF 16V Y5V RADIAL | Dotaz |
|
FK11Y5V0J107Z | TDK Corporation | CAP CER 100UF 6.3V Y5V RADIAL | Dotaz |
|
FK11Y5V1E106Z | TDK Corporation | CAP CER 10UF 25V Y5V RADIAL | Dotaz |
|
FK11Y5V1C476Z | TDK Corporation | CAP CER 47UF 16V Y5V RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers