Koupit EDLNF104A5R5C s BYCHPS
Koupit se zárukou
EDLNF104A5R5C
- Part Number:
- EDLNF104A5R5C
- Výrobce:
- Cornell Dubilier Electronics
- Popis:
- CAP 100MF 5.5V THROUGH HOLE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12423 Pieces
- Datový list:
- EDLNF104A5R5C.pdf
Úvod
BYCHIPS je distribuční odrůda pro EDLNF104A5R5C, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu EDLNF104A5R5C e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 5.5V |
|---|---|
| Tolerance: | - |
| Ukončení: | Through Hole |
| Velikost / Rozměry: | 0.531" Dia (13.50mm) |
| Série: | NF |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can |
| Provozní teplota: | -25°C ~ 70°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | EDLNF104A5R5C |
| Životnost @ Temp.: | 1000 Hrs @ 70°C |
| Rozestup vývodù: | 0.197" (5.00mm) |
| Výška - Sedící (Max): | 0.295" (7.50mm) |
| Rozšířený popis: | 100mF (EDLC) Supercapacitor 5.5V Radial, Can 75 Ohm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Resistance Series): | 75 Ohm @ 1kHz |
| Popis: | CAP 100MF 5.5V THROUGH HOLE |
| kapacitní: | 100mF |
| Email: | [email protected] |
Související díly pro EDLNF104A5R5C
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
EDLNF155B5R5C | Cornell Dubilier Electronics (CDE) | CAP 1.5F 5.5V THROUGH HOLE | Dotaz |
 |
DZN-2R5D704G4T | Elna America | CAP 700MF -20% +80% 2.5V T/H | Dotaz |
 |
MAL219691211E3 | Vishay BC Components | CAP ALUM 15F 1.4V SNAP | Dotaz |
|
MAL219622474E3 | Vishay BC Components | CAP 470MF -20%, +80% 5.5V T/H | Dotaz |
 |
EDLNF224A5R5C | Cornell Dubilier Electronics (CDE) | CAP 220MF 5.5V THROUGH HOLE | Dotaz |
|
EDLNF105B5R5C | Cornell Dubilier Electronics (CDE) | CAP 1F 5.5V THROUGH HOLE | Dotaz |
|
EDLNF474B5R5C | Cornell Dubilier Electronics (CDE) | CAP 470MF 5.5V THROUGH HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers