Koupit DVS-3R6D473T-R5 s BYCHPS
Koupit se zárukou
DVS-3R6D473T-R5
- Part Number:
- DVS-3R6D473T-R5
- Výrobce:
- Elna America
- Popis:
- CAP 47MF 3.6V SURFACE MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15750 Pieces
- Datový list:
- DVS-3R6D473T-R5.pdf
Úvod
BYCHIPS je distribuční odrůda pro DVS-3R6D473T-R5, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu DVS-3R6D473T-R5 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 3.6V |
|---|---|
| Tolerance: | - |
| Ukončení: | Surface Mount |
| Velikost / Rozměry: | 0.492" Dia (12.50mm) |
| Série: | DVS |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Radial, Can - SMD |
| Ostatní jména: | 604-1172-2 DVS-3R6D473T-R DVS3R6D473TR5 |
| Provozní teplota: | -25°C ~ 85°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 18 Weeks |
| Výrobní číslo výrobce: | DVS-3R6D473T-R5 |
| Životnost @ Temp.: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | 0.335" (8.50mm) |
| Rozšířený popis: | 47mF (EDLC) Supercapacitor 3.6V Radial, Can - SMD 30 Ohm |
| ESR (Equivalent Resistance Series): | 30 Ohm |
| Popis: | CAP 47MF 3.6V SURFACE MOUNT |
| kapacitní: | 47mF |
| Email: | [email protected] |
Související díly pro DVS-3R6D473T-R5
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CDLC302P2R7K04 | Cornell Dubilier Electronics (CDE) | CAP 3000F 0% +20% 2.7V CHAS MNT | Dotaz |
 |
DVS-3R6D224T-R5 | Elna America | CAP 220MF 3.6V SURFACE MOUNT | Dotaz |
 |
B49410B2126Q000 | EPCOS (TDK) | CAP 1200F -10% +30% 2.5V CHAS MT | Dotaz |
|
DVS-3R6D334T-R5 | Elna America | CAP 330MF 3.6V SURFACE MOUNT | Dotaz |
|
DVS-3R6D104T-R5 | Elna America | CAP 100MF 3.6V SURFACE MOUNT | Dotaz |
 |
HB1635-2R5356-R | Eaton | CAP 35F -10% +30% 2.5V T/H | Dotaz |
 |
MAL219691204E3 | Vishay BC Components | CAP 15F -20% +80% 5.6V T/H | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers