Koupit DS36277TM/NOPB s BYCHPS
Koupit se zárukou
DS36277TM/NOPB
- Part Number:
- DS36277TM/NOPB
- Výrobce:
- Popis:
- IC TRANSCEIVER MUTLIPOINT 8-SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16913 Pieces
- Datový list:
- DS36277TM/NOPB.pdf
Úvod
BYCHIPS je distribuční odrůda pro DS36277TM/NOPB, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu DS36277TM/NOPB e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 4.75 V ~ 5.25 V |
|---|---|
| Typ: | Transceiver |
| Dodavatel zařízení Package: | 8-SOIC |
| Série: | - |
| Přijímačová hystereze: | 80mV |
| Protokol: | RS422, RS485 |
| Obal: | Tube |
| Paket / krabice: | 8-SOIC (0.154", 3.90mm Width) |
| Ostatní jména: | *DS36277TM *DS36277TM/NOPB DS36277TM DS36277TM-ND |
| Provozní teplota: | -40°C ~ 85°C |
| Počet řidičů / Přijímače: | 1/1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | DS36277TM/NOPB |
| Rozšířený popis: | 1/1 Transceiver Half RS422, RS485 8-SOIC |
| Duplex: | Half |
| Popis: | IC TRANSCEIVER MUTLIPOINT 8-SOIC |
| Rychlost přenosu dat: | - |
| Email: | [email protected] |
Související díly pro DS36277TM/NOPB
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
|
DS36277TMX/NOPB | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
|
DS36276M | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
|
DS36276MX/NOPB | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
|
DS36276MX | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
|
DS36277TN/NOPB | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-DIP | Dotaz |
|
DS36277TMX | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
|
DS36276M/NOPB | Texas Instruments | IC TRANSCEIVER MUTLIPOINT 8-SOIC | Dotaz |
 |
USB1T1102MHX | Fairchild/ON Semiconductor | IC TXRX USB 12MBPS 16MHBCC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers