Koupit DRV411AIPWP s BYCHPS
Koupit se zárukou
DRV411AIPWP
- Part Number:
- DRV411AIPWP
- Výrobce:
- Popis:
- IC SENSOR SIGNAL COND 20HTSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15350 Pieces
- Datový list:
- DRV411AIPWP.pdf
Úvod
BYCHIPS je distribuční odrůda pro DRV411AIPWP, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu DRV411AIPWP e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Signal Conditioner |
|---|---|
| Dodavatel zařízení Package: | 20-HTSSOP |
| Série: | - |
| Obal: | Tube |
| Paket / krabice: | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
| Typ výstupu: | - |
| Ostatní jména: | 296-37170-5 |
| Provozní teplota: | -40°C ~ 125°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | DRV411AIPWP |
| Rozhraní: | - |
| Typ vstupu: | - |
| Popis: | IC SENSOR SIGNAL COND 20HTSSOP |
| Proud - Supply: | 6mA |
| Email: | [email protected] |
Související díly pro DRV411AIPWP
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MAX1456CWI+ | Maxim Integrated | IC SGNL CONDITIONER 28-SOIC | Dotaz |
|
DRV411AIRGPR | Texas Instruments | IC SENSOR SIGNAL COND 20QFN | Dotaz |
|
DRV411AIPWPR | Texas Instruments | IC SENSOR SIGNAL COND 20HTSSOP | Dotaz |
|
DRV411AIRGPT | Texas Instruments | IC SENSOR SIGNAL COND 20-QFN | Dotaz |
 |
MAX1452ATG+T | Maxim Integrated | IC SENSOR SIGNAL COND 24TQFN | Dotaz |
 |
AD8496ARMZ | Analog Devices Inc. | IC THRMOCPLE AMP 8MSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers