Koupit DRV401AIRGWTG4 s BYCHPS
Koupit se zárukou
DRV401AIRGWTG4
- Part Number:
- DRV401AIRGWTG4
- Výrobce:
- Popis:
- IC SENSOR SIGNAL COND 20VQFN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17689 Pieces
- Datový list:
- DRV401AIRGWTG4.pdf
Úvod
BYCHIPS je distribuční odrůda pro DRV401AIRGWTG4, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu DRV401AIRGWTG4 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Sensor Conditioner |
|---|---|
| Dodavatel zařízení Package: | 20-VQFN (5x5) |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 20-VQFN Exposed Pad |
| Typ výstupu: | Logic |
| Provozní teplota: | -40°C ~ 125°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 2 (1 Year) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | DRV401AIRGWTG4 |
| Rozhraní: | - |
| Typ vstupu: | Logic |
| Popis: | IC SENSOR SIGNAL COND 20VQFN |
| Proud - Supply: | 6.8mA |
| Email: | [email protected] |
Související díly pro DRV401AIRGWTG4
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
AD22050NZ | Analog Devices Inc. | IC AMP DIFF SGL SUPPLY 8-DIP | Dotaz |
|
DRV401AIRGWR | Texas Instruments | IC SENSOR SIGNAL COND 20VQFN | Dotaz |
|
DRV401AIDWP | Texas Instruments | IC SENSOR SIGNAL COND 20SOPWRPAD | Dotaz |
|
DRV401AIRGWT | Texas Instruments | IC SENSOR SIGNAL COND 20VQFN | Dotaz |
|
DRV401AQRGWRQ1 | Texas Instruments | IC SIGNAL CONDITIONER 20VQFN | Dotaz |
|
DRV401AIDWPG4 | Texas Instruments | IC SENSOR SIGNAL COND 20SOPWRPAD | Dotaz |
|
DRV401AIRGWRG4 | Texas Instruments | IC SENSOR SIGNAL COND 20VQFN | Dotaz |
|
DRV401AIDWPRG4 | Texas Instruments | IC SENSOR SIGNAL COND 20SOPWRPAD | Dotaz |
|
DRV401AIDWPR | Texas Instruments | IC SENSOR SIGNAL COND 20SOPWRPAD | Dotaz |
|
DRV401AMDWPREP | Texas Instruments | IC SENSOR SIGNAL COND 20SOPWRPAD | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers