Koupit CNS123900 s BYCHPS
Koupit se zárukou
CNS123900
- Part Number:
- CNS123900
- Výrobce:
- Amphenol Pcd
- Popis:
- SOCKET CONTACT SZ12/12
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13569 Pieces
- Datový list:
- 1.CNS123900.pdf2.CNS123900.pdf
Úvod
BYCHIPS je distribuční odrůda pro CNS123900, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CNS123900 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | CNS123900 |
| Rozšířený popis: | |
| Popis: | SOCKET CONTACT SZ12/12 |
| Email: | [email protected] |
Související díly pro CNS123900
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CNS126900 | Amphenol PCD | SOCKET CONTACT SZ16/16 | Dotaz |
 |
3-1437683-0 | TE Connectivity AMP Connectors | BAIL TIE DOWN TIMER | Dotaz |
|
CNS128900 | Amphenol PCD | SOCKET CONTACT SZ12/12 | Dotaz |
 |
J7T-E170 | Omron Automation and Safety | THERMAL RELAY | Dotaz |
|
CNS101554 | Amphenol PCD | SOCKET CONTACT SZ16/16 | Dotaz |
 |
70G-ISW1 | Grayhill Inc. | TEST MOD INPUT | Dotaz |
|
CNS129900 | Amphenol PCD | SOCKET CONTACT SZ12/16 | Dotaz |
 |
ADX18001 | Panasonic Industrial Automation Sales | SPRING-HOLDING CLIP 2PC | Dotaz |
|
CNS127900 | Amphenol PCD | SOCKET CONTACT SZ16/20 | Dotaz |
 |
HS351 | Crydom Co. | HEATSINK SSR 3.5DEG C/W PNL MNT | Dotaz |
 |
8533771001 | Weidmuller | PXS35 PLUGSERIES BASE SC | Dotaz |
|
PYC-E1 | Omron Automation and Safety | HOLD DOWN CLIP FOR MY RELAY | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers