Koupit CGB2A1X6S0G474K033BC s BYCHPS
Koupit se zárukou
CGB2A1X6S0G474K033BC
- Part Number:
- CGB2A1X6S0G474K033BC
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 0.47UF 4V X6S 0402
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15432 Pieces
Úvod
BYCHIPS je distribuční odrůda pro CGB2A1X6S0G474K033BC, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CGB2A1X6S0G474K033BC e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 4V |
|---|---|
| Tolerance: | ±10% |
| Tloušťka (Max): | 0.013" (0.33mm) |
| teplotní koeficient: | X6S |
| Velikost / Rozměry: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Série: | CGB |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 0402 (1005 Metric) |
| Ostatní jména: | 445-15609-2 CGB2A1X6S0G474K033BB CGB2A1X6S0G474KT000N |
| Provozní teplota: | -55°C ~ 105°C |
| Typ montáže: | Surface Mount, MLCC |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | CGB2A1X6S0G474K033BC |
| Lead Style: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | Low Profile |
| Poruchovost: | - |
| Rozšířený popis: | 0.47µF ±10% 4V Ceramic Capacitor X6S 0402 (1005 Metric) |
| Popis: | CAP CER 0.47UF 4V X6S 0402 |
| kapacitní: | 0.47µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro CGB2A1X6S0G474K033BC
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CGB2A1X6S0J105K033BC | TDK Corporation | CAP CER 1UF 6.3V X6S 0402 | Dotaz |
|
CGB2A1X6S0G105K033BC | TDK Corporation | CAP CER 1UF 4V X6S 0402 | Dotaz |
|
CGB2A1X5R1A105M033BC | TDK Corporation | CAP CER 1UF 10V X5R 0402 | Dotaz |
|
CGB2A1X6S0G474M033BC | TDK Corporation | CAP CER 0.47UF 4V X6S 0402 | Dotaz |
|
CGB2A1X6S1A474K033BC | TDK Corporation | CAP CER 0.47UF 10V X6S 0402 | Dotaz |
|
CGB2A1X6S0G105M033BC | TDK Corporation | CAP CER 1UF 4V X6S 0402 | Dotaz |
|
CGB2A1X6S1A105M033BC | TDK Corporation | CAP CER 1UF 10V X6S 0402 | Dotaz |
|
CGB2A1X6S1A474M033BC | TDK Corporation | CAP CER 0.47UF 10V X6S 0402 | Dotaz |
|
CGB2A1X6S0J105M033BC | TDK Corporation | CAP CER 1UF 6.3V X6S 0402 | Dotaz |
|
CGB2A1X5R1C474M033BC | TDK Corporation | CAP CER 0.47UF 16V X5R 0402 | Dotaz |
|
CGB2A1X6S1A105K033BC | TDK Corporation | CAP CER 1UF 10V X6S 0402 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers