Koupit CDV30FK151JO3F s BYCHPS
Koupit se zárukou
CDV30FK151JO3F
- Part Number:
- CDV30FK151JO3F
- Výrobce:
- Cornell Dubilier Electronics
- Popis:
- MICA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15406 Pieces
- Datový list:
- CDV30FK151JO3F.pdf
Úvod
BYCHIPS je distribuční odrůda pro CDV30FK151JO3F, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CDV30FK151JO3F e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | CDV30FK151JO3F |
| Rozšířený popis: | Capacitor |
| Popis: | MICA |
| Email: | [email protected] |
Související díly pro CDV30FK151JO3F
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CDV30FK152GO3F | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK151FO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK152GO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK151GO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK151GO3F | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK152JO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 1500PF 5% 2500V RADIAL | Dotaz |
|
CDV30FK121JO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 120PF 5% 2500V RADIAL | Dotaz |
|
CDV30FK152JO3F | Cornell Dubilier Electronics (CDE) | CAP MICA 1500PF 5% 2500V RADIAL | Dotaz |
|
CDV30FK151FO3F | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK151JO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK152FO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK181FO3F | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK122GO3 | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
|
CDV30FK152FO3F | Cornell Dubilier Electronics (CDE) | MICA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers