Koupit C2012X6S1A685M085AC s BYCHPS
Koupit se zárukou
C2012X6S1A685M085AC
- Part Number:
- C2012X6S1A685M085AC
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 6.8UF 10V X6S 0805
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12329 Pieces
Úvod
BYCHIPS je distribuční odrůda pro C2012X6S1A685M085AC, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu C2012X6S1A685M085AC e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 10V |
|---|---|
| Tolerance: | ±20% |
| Tloušťka (Max): | 0.039" (1.00mm) |
| teplotní koeficient: | X6S |
| Velikost / Rozměry: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Série: | C |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 0805 (2012 Metric) |
| Ostatní jména: | 445-14481-2 C2012X6S1A685MT0J0E |
| Provozní teplota: | -55°C ~ 105°C |
| Typ montáže: | Surface Mount, MLCC |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | C2012X6S1A685M085AC |
| Lead Style: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | Low ESL |
| Poruchovost: | - |
| Rozšířený popis: | 6.8µF ±20% 10V Ceramic Capacitor X6S 0805 (2012 Metric) |
| Popis: | CAP CER 6.8UF 10V X6S 0805 |
| kapacitní: | 6.8µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro C2012X6S1A685M085AC
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
C2012X6S1A685K125AB | TDK Corporation | CAP CER 6.8UF 10V X6S 0805 | Dotaz |
|
C2012X6S1A685M125AB | TDK Corporation | CAP CER 6.8UF 10V X6S 0805 | Dotaz |
|
C2012X6S1H105M125AB | TDK Corporation | CAP CER 1UF 50V X6S 0805 | Dotaz |
|
C2012X6S1H105K125AB | TDK Corporation | CAP CER 1UF 50V X6S 0805 | Dotaz |
 |
C2012X6S1C475K085AC | TDK Corporation | CAP CER 4.7UF 16V X6S 0805 | Dotaz |
|
C2012X6S1A226K | TDK Corporation | CAP CER 22UF 10V X6S 0805 | Dotaz |
|
C2012X6S1H225M125AB | TDK Corporation | CAP CER 2.2UF 50V X6S 0805 | Dotaz |
|
C2012X6S1C226M125AC | TDK Corporation | CAP CER 22UF 16V X6S 0805 | Dotaz |
|
C2012X6S1H105K085AB | TDK Corporation | CAP CER 1UF 50V X6S 0805 | Dotaz |
|
C2012X6S1A685K085AC | TDK Corporation | CAP CER 6.8UF 10V X6S 0805 | Dotaz |
|
C2012X6S1C106K125AC | TDK Corporation | CAP CER 10UF 16V X6S 0805 | Dotaz |
|
C2012X6S1V335K125AB | TDK Corporation | CAP CER 3.3UF 35V X6S 0805 | Dotaz |
|
C2012X6S1V225M125AB | TDK Corporation | CAP CER 2.2UF 35V X6S 0805 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers