Koupit BU8874F-E2 s BYCHPS
Koupit se zárukou
BU8874F-E2
- Part Number:
- BU8874F-E2
- Výrobce:
- LAPIS Semiconductor
- Popis:
- IC DTMF RCVR FOR PHONE SOP18 TR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17114 Pieces
- Datový list:
- BU8874F-E2.pdf
Úvod
BYCHIPS je distribuční odrůda pro BU8874F-E2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BU8874F-E2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 4.75 V ~ 5.25 V |
|---|---|
| Dodavatel zařízení Package: | 18-SOP |
| Série: | - |
| Příkon (W): | 550mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 18-SOIC (0.213", 5.40mm Width) |
| Ostatní jména: | BU8874F-E2-ND BU8874F-E2TR |
| Provozní teplota: | -10°C ~ 70°C |
| Počet okruhů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | BU8874F-E2 |
| Rozhraní: | - |
| Zahrnuje: | Power Down Mode |
| Funkce: | Receiver, DTMF |
| Rozšířený popis: | Telecom IC Receiver, DTMF 18-SOP |
| Popis: | IC DTMF RCVR FOR PHONE SOP18 TR |
| Proud - Supply: | 2.2mA |
| Email: | [email protected] |
Související díly pro BU8874F-E2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
VSC8541XMV-03 | Microsemi Solutions Sdn Bhd. | IC ETHERNET RGMII/RMII 68QFN | Dotaz |
 |
BU8872FS-E2 | Rohm Semiconductor | IC DTMF RCVR FOR PHN SSOP-A16 TR | Dotaz |
|
BU8874 | Rohm Semiconductor | IC DTMF RECEIVER FOR PHONE DIP8 | Dotaz |
 |
SI3068-B-FTR | Silicon Labs | IC DAA FCC+ EMBEDDED 10SOIC | Dotaz |
 |
XRT72L53IB-F | Exar Corporation | IC FRAMER DS3/E3 3CH 272BGA | Dotaz |
 |
MT8952BS1 | Microsemi Corporation | IC HDLC PROTOCOL CTLR 28SOIC | Dotaz |
 |
DS2155LN | Maxim Integrated | IC TXRX T1/E1/J1 1-CHIP 100-LQFP | Dotaz |
|
ZL88602LDG1 | Microsemi Corporation | IC ABS VOICEPORT 2CH FXS 64QFN | Dotaz |
|
DS26303LN-120+ | Maxim Integrated | IC LIU E1/T1/J1 3.3V 144-ELQFP | Dotaz |
 |
82P2821BH | IDT, Integrated Device Technology Inc | IC LIU T1/J1/E1 21+1CH 640BGA | Dotaz |
|
MT3371BSR1 | Microsemi Corporation | IC RECEIVER DTMF 50DB 18SOIC | Dotaz |
 |
BU8871F-E2 | Rohm Semiconductor | IC DTMF RECEIVER SOP18 TR | Dotaz |
|
MT88L70ASR1 | Microsemi Corporation | IC RECEIVER DTMF 18SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog