Koupit BSPS2255TT s BYCHPS
Koupit se zárukou
BSPS2255TT
- Part Number:
- BSPS2255TT
- Výrobce:
- Bussmann (Eaton)
- Popis:
- COMBND LIGHTNNG CURRENT & SURGE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14104 Pieces
- Datový list:
- BSPS2255TT.pdf
Úvod
BYCHIPS je distribuční odrůda pro BSPS2255TT, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BSPS2255TT e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - DC Spark Over (nom): | 230V |
|---|---|
| Tolerance: | - |
| Série: | BPS |
| Obal: | Bulk |
| Paket / krabice: | Module |
| Počet pólů: | 2 |
| Typ montáže: | DIN Rail |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 7 Weeks |
| Výrobní číslo výrobce: | BSPS2255TT |
| Impulsní výbojový proud (8 / 20μs): | - |
| selhání Short: | No |
| Rozšířený popis: | Gas Discharge Tube 2 Pole DIN Rail |
| Popis: | COMBND LIGHTNNG CURRENT & SURGE |
| Email: | [email protected] |
Související díly pro BSPS2255TT
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CG37.5L | Littelfuse Inc. | GDT 7500V 5KA THROUGH HOLE | Dotaz |
 |
9400320000 | Weidmuller | GDT 230V DIN RAIL | Dotaz |
 |
B88069X4300C251 | EPCOS (TDK) | GDT 1400V 20% 20KA THROUGH HOLE | Dotaz |
 |
BSPS2255TTR | Eaton | COMBND LGHTNG CURRNT & SURGE 1+1 | Dotaz |
|
BSPS2255TNR | Eaton | CMBIND LGHTNG CRENT & SRGE 1 REM | Dotaz |
|
BSPS2255TN | Eaton | COMBIND LIGHTNING CURRENT & SURG | Dotaz |
 |
B88069X4131S102 | EPCOS (TDK) | GDT 230V 5KA THROUGH HOLE | Dotaz |
 |
SL1024A150C | Littelfuse Inc. | GDT 150V 10KA | Dotaz |
|
SL1024A230RG | Littelfuse Inc. | GDT 230V 10KA T/H FAIL SHORT | Dotaz |
 |
2036-07-B3FLF | Bourns Inc. | GDT 75V 20% 10KA T/H FAIL SHORT | Dotaz |
 |
2026-30-C18 | Bourns Inc. | GDT 300V 20% 20KA THROUGH HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers