Koupit BR25H080F-WCE2 s BYCHPS
Koupit se zárukou
BR25H080F-WCE2
- Part Number:
- BR25H080F-WCE2
- Výrobce:
- LAPIS Semiconductor
- Popis:
- IC EEPROM 8KBIT 5MHZ 8SOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12758 Pieces
- Datový list:
- BR25H080F-WCE2.pdf
Úvod
BYCHIPS je distribuční odrůda pro BR25H080F-WCE2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BR25H080F-WCE2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.5 V ~ 5.5 V |
|---|---|
| Dodavatel zařízení Package: | 8-SOP |
| Rychlost: | 5MHz |
| Série: | Automotive, AEC-Q100 |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 8-SOIC (0.173", 4.40mm Width) |
| Ostatní jména: | BR25H080FWCE2 |
| Provozní teplota: | -40°C ~ 125°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Typ paměti: | Non-Volatile |
| Velikost paměti: | 8Kb (1K x 8) |
| Formát paměti: | EEPROM |
| Výrobní číslo výrobce: | BR25H080F-WCE2 |
| Rozhraní: | SPI Serial |
| Popis: | IC EEPROM 8KBIT 5MHZ 8SOP |
| Email: | [email protected] |
Související díly pro BR25H080F-WCE2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
RMLV0414EGSB-4S2#HA1 | Renesas Electronics America | IC SRAM 4MBIT 45NS 44TSOP | Dotaz |
 |
BR25H040FJ-WCE2 | Rohm Semiconductor | IC EEPROM 4KBIT 5MHZ 8SOP | Dotaz |
 |
M25P10-AVMN6TP TR | Micron Technology Inc. | IC FLASH 1MBIT 50MHZ 8SO | Dotaz |
 |
BR25H010F-2CE2 | Rohm Semiconductor | IC EEPROM 1KBIT 10MHZ 8SOP | Dotaz |
 |
24AA024-I/MS | Microchip Technology | IC EEPROM 2KBIT 400KHZ 8MSOP | Dotaz |
|
BR25H010FJ-WCE2 | Rohm Semiconductor | IC EEPROM 1KBIT 5MHZ 8SOP | Dotaz |
|
BR25H080FVT-WCE2 | Rohm Semiconductor | IC EEPROM 8KBIT 5MHZ 8TSSOP | Dotaz |
|
BR25H080FJ-WCE2 | Rohm Semiconductor | IC EEPROM 8KBIT 5MHZ 8SOP | Dotaz |
|
BR25H160FJ-WCE2 | Rohm Semiconductor | IC EEPROM 16KBIT 10MHZ 8SOPJ | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers