Koupit BH7641FV-E2 s BYCHPS
Koupit se zárukou
BH7641FV-E2
- Part Number:
- BH7641FV-E2
- Výrobce:
- LAPIS Semiconductor
- Popis:
- IC VIDEO INTERFACE SSOP-B40
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17768 Pieces
- Datový list:
- BH7641FV-E2.pdf
Úvod
BYCHIPS je distribuční odrůda pro BH7641FV-E2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BH7641FV-E2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Interface |
|---|---|
| Dodavatel zařízení Package: | 40-SSOPB |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 40-SSOP |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | BH7641FV-E2 |
| Popis: | IC VIDEO INTERFACE SSOP-B40 |
| Aplikace: | Set-Top Boxes, TV |
| Email: | [email protected] |
Související díly pro BH7641FV-E2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ZXFV4583N16TA | Diodes Incorporated | IC SEPARATOR VIDEO SYNC 16-SOIC | Dotaz |
 |
FT812Q-T | FTDI, Future Technology Devices International Ltd | IC GRAPHIC CTRL 56 PIN QFN | Dotaz |
 |
TDA9884TS/V1,118 | NXP USA Inc. | IC IF-PLL I2C-BUS DEMOD 24-SSOP | Dotaz |
 |
BA7071F-E2 | Rohm Semiconductor | IC SEPARATOR SYNC W/AFC SOP8 | Dotaz |
 |
VSP2260YG4 | Texas Instruments | IC VIDEO CCD SIGNAL PROC 48LQFP | Dotaz |
 |
MAX9568EEE+T | Maxim Integrated | IC SYNC SEPARATOR ANLG 16-QSOP | Dotaz |
 |
TDA10026HN/C1,557 | NXP USA Inc. | IC DEMODULATOR SGL 64-HVQFN | Dotaz |
|
VSP2270M/2KG4 | Texas Instruments | IC VIDEO CCD SIGNAL PROC 48QFN | Dotaz |
 |
FT801Q-R | FTDI, Future Technology Devices International Ltd | IC TFT LCD CONTROLLER 48VQFN | Dotaz |
 |
STV2050A | STMicroelectronics | IC DGTL CONVERGENCE PROC 80QFP | Dotaz |
 |
TW2824M-RB | Intersil | IC VID QUAD/MUX CTRL 4CH | Dotaz |
|
BH7649KS2 | Rohm Semiconductor | IC VIDEO SIGNAL SWITCHER 52SQFP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers