Koupit BD3893FV-E2 s BYCHPS
Koupit se zárukou
BD3893FV-E2
- Part Number:
- BD3893FV-E2
- Výrobce:
- LAPIS Semiconductor
- Popis:
- IC SIGNAL PROCESSOR 16SSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14638 Pieces
- Datový list:
- BD3893FV-E2.pdf
Úvod
BYCHIPS je distribuční odrůda pro BD3893FV-E2, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BD3893FV-E2 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Signal Processor |
|---|---|
| Dodavatel zařízení Package: | 16-SSOPB |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 16-LSSOP (0.173", 4.40mm Width) |
| Typ výstupu: | Analog |
| Provozní teplota: | -25°C ~ 75°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 7 Weeks |
| Výrobní číslo výrobce: | BD3893FV-E2 |
| Rozhraní: | - |
| Typ vstupu: | Analog |
| Popis: | IC SIGNAL PROCESSOR 16SSOP |
| Proud - Supply: | - |
| Email: | [email protected] |
Související díly pro BD3893FV-E2
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BU21072MUV-E2 | Rohm Semiconductor | IC CAP SENSOR SWITCH 24VQFN | Dotaz |
 |
BD3897FVM-TR | Rohm Semiconductor | IC SIGNAL PROCESSOR 8MSOP | Dotaz |
 |
MAX31850JATB+T | Maxim Integrated | IC CONV THRMCPLE-DIG J TYPE TDFN | Dotaz |
 |
BD3897FV-E2 | Rohm Semiconductor | IC SIGNAL PROCESSOR 16SSOP | Dotaz |
 |
LM1815N/NOPB | Texas Instruments | IC AMP ADAPTIVE SENSOR 14-DIP | Dotaz |
|
BD3896FV-E2 | Rohm Semiconductor | IC SIGNAL PROCESSOR 16SSOP | Dotaz |
 |
QT100A-ISG | Microchip Technology | IC SENS TOUCH/PROX 1CHAN 6-WSON | Dotaz |
 |
AD9974BBCZRL | Analog Devices Inc. | IC CCDSP DUAL 14BIT 100CSBGA | Dotaz |
 |
TDC-GPX2 | ams | IC CONVERTER TIME-FLIGHT 64QFN | Dotaz |
 |
AS8510-ASSP | ams | IC BATTERY MANAGEMENT 20-SSOP | Dotaz |
|
MAX1454AUE/V+ | Maxim Integrated | IC PRECISION SIGNAL COND 16TSSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers