Koupit BCV62C,215 s BYCHPS
Koupit se zárukou
BCV62C,215
- Part Number:
- BCV62C,215
- Výrobce:
- Nexperia
- Popis:
- TRANS PNP 30V 100MA DUAL SOT143B
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18541 Pieces
- Datový list:
- BCV62C,215.pdf
Úvod
BYCHIPS je distribuční odrůda pro BCV62C,215, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BCV62C,215 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 30V |
|---|---|
| Transistor Type: | 2 PNP (Dual) Current Mirror |
| Dodavatel zařízení Package: | SOT-143B |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | TO-253-4, TO-253AA |
| Ostatní jména: | 1727-4901-2 568-6118-2 568-6118-2-ND 933792150215 BCV62C T/R BCV62C T/R-ND BCV62C,215-ND BCV62C215 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 4 Weeks |
| Výrobní číslo výrobce: | BCV62C,215 |
| Rozšířený popis: | Transistor Current Mirror 2 PNP (Dual) Current Mirror 30V 100mA Surface Mount SOT-143B |
| Popis: | TRANS PNP 30V 100MA DUAL SOT143B |
| Jmenovitá hodnota proudu: | 100mA |
| Aplikace: | Current Mirror |
| Email: | [email protected] |
Související díly pro BCV62C,215
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ALD810025SCL | Advanced Linear Devices Inc. | MOSFET QUAD SAB 10.6V 16SOIC | Dotaz |
 |
BCV62B,235 | Nexperia USA Inc. | TRANS PNP 30V 100MA DUAL SOT143B | Dotaz |
|
BCV62,215 | Nexperia USA Inc. | TRANS PNP 30V 100MA DUAL SOT143B | Dotaz |
|
BCV62A,215 | Nexperia USA Inc. | TRANS PNP 30V 100MA DUAL SOT143B | Dotaz |
|
BCV62B,215 | Nexperia USA Inc. | TRANS PNP 30V 100MA DUAL SOT143B | Dotaz |
|
ALD910023SAL | Advanced Linear Devices Inc. | MOSFET DUAL SAB 10.6V 8SOIC | Dotaz |
|
BCV62,235 | Nexperia USA Inc. | TRANS PNP 30V 100MA DUAL SOT143B | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers