Koupit B57237S259M54 s BYCHPS
Koupit se zárukou
B57237S259M54
- Part Number:
- B57237S259M54
- Výrobce:
- EPCOS
- Popis:
- ICL 2.5 OHM 20% 6.5A 15MM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18468 Pieces
- Datový list:
- B57237S259M54.pdf
Úvod
BYCHIPS je distribuční odrůda pro B57237S259M54, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B57237S259M54 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±20% |
|---|---|
| Série: | - |
| R Aktuální: | - |
| R 25 ° C: | 2.5 Ohm |
| Obal: | Tape & Reel (TR) |
| Ostatní jména: | B57237S 259M 54 B57237S0259M054 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | B57237S259M54 |
| Rozestup vývodù: | 0.295" (7.50mm) |
| Rozšířený popis: | Inrush Current Limiter 2.5 Ohm Ohm ±20% 0.59" (15mm) |
| Průměr: | 0.59" (15mm) |
| Popis: | ICL 2.5 OHM 20% 6.5A 15MM |
| Proud - Steady State Max: | 6.5A |
| schválení: | UL |
| Email: | [email protected] |
Související díly pro B57237S259M54
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B57237S259M53 | EPCOS (TDK) | ICL 2.5 OHM 20% 6.5A 15MM | Dotaz |
|
B57237S109M51 | EPCOS (TDK) | ICL 1 OHM 20% 9A 15MM | Dotaz |
|
B57237S259M51 | EPCOS (TDK) | ICL 2.5 OHM 20% 6.5A 15MM | Dotaz |
|
B57237S229M54 | EPCOS (TDK) | ICL 2.2 OHM 20% 7A 15MM | Dotaz |
|
B57237S220M51 | EPCOS (TDK) | ICL 22 OHM 20% 2.8A 15MM | Dotaz |
|
B57237S229M51 | EPCOS (TDK) | ICL 2.2 OHM 20% 7A 15MM | Dotaz |
|
B57237S709M51 | EPCOS (TDK) | ICL 7 OHM 20% 4.2A 15MM | Dotaz |
|
B57237S259M | EPCOS (TDK) | ICL 2.5 OHM 20% 6.5A 15MM | Dotaz |
|
B57237S220M | EPCOS (TDK) | ICL 22 OHM 20% 2.8A 15MM | Dotaz |
|
B57237S600M51 | EPCOS (TDK) | ICL 60 OHM 20% 2A 15MM | Dotaz |
|
B57237S229M | EPCOS (TDK) | ICL 2.2 OHM 20% 7A 15MM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers