Koupit B43501C2687M67 s BYCHPS
Koupit se zárukou
B43501C2687M67
- Part Number:
- B43501C2687M67
- Výrobce:
- EPCOS
- Popis:
- CAP ALUM 680UF 20% 250V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15201 Pieces
- Datový list:
- B43501C2687M67.pdf
Úvod
BYCHIPS je distribuční odrůda pro B43501C2687M67, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B43501C2687M67 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 250V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 0.984" Dia (25.00mm) |
| Série: | B43501 |
| Ripple Current: | 2.59A @ 100Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Ostatní jména: | B43501C2687M 67 B43501C2687M067 |
| Provozní teplota: | -40°C ~ 85°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B43501C2687M67 |
| Životnost @ Temp.: | 10000 Hrs @ 85°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | 190 mOhm |
| Výška - Sedící (Max): | 1.850" (47.00mm) |
| Rozšířený popis: | 680µF 250V Aluminum Capacitors Radial, Can - Snap-In 150 mOhm @ 100Hz 10000 Hrs @ 85°C |
| ESR (Equivalent Resistance Series): | 150 mOhm @ 100Hz |
| Popis: | CAP ALUM 680UF 20% 250V SNAP |
| kapacitní: | 680µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro B43501C2687M67
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B43501C2687M | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
|
B43501C2687M82 | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
|
B43501C2687M80 | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
|
B43501C2687M87 | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
|
B43501C2687M60 | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
|
B43501C2687M62 | EPCOS (TDK) | CAP ALUM 680UF 20% 250V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers