Koupit B32912B3334M189 s BYCHPS
Koupit se zárukou
B32912B3334M189
- Part Number:
- B32912B3334M189
- Výrobce:
- EPCOS
- Popis:
- CAP FILM 0.33UF 20% 760VDC RAD
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14361 Pieces
- Datový list:
- B32912B3334M189.pdf
Úvod
BYCHIPS je distribuční odrůda pro B32912B3334M189, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B32912B3334M189 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napìtí - DC: | 760V |
|---|---|
| Napìtí - AC: | 330V |
| Tolerance: | ±20% |
| Ukončení: | PC Pins |
| Velikost / Rozměry: | 0.709" L x 0.354" W (18.00mm x 9.00mm) |
| Série: | B32912 |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Radial |
| Ostatní jména: | 495-7093-2 B32912B3334M189-ND |
| Provozní teplota: | -40°C ~ 110°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B32912B3334M189 |
| Rozestup vývodù: | 0.591" (15.00mm) |
| Výška - Sedící (Max): | 0.689" (17.50mm) |
| Funkce: | X1 Safety Rated |
| Rozšířený popis: | 0.33µF ±20% Film Capacitor 330V 760V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Resistance Series): | - |
| dielektrikum Materiál: | Polypropylene (PP), Metallized |
| Popis: | CAP FILM 0.33UF 20% 760VDC RAD |
| kapacitní: | 0.33µF |
| Aplikace: | EMI, RFI Suppression |
| Email: | [email protected] |
Související díly pro B32912B3334M189
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B32912A3473M189 | EPCOS (TDK) | CAP FILM 0.047UF 20% 760VDC RAD | Dotaz |
 |
B32912B3334M289 | EPCOS (TDK) | CAP FILM 0.33UF 20% 760VDC RAD | Dotaz |
|
B32912B3224M | EPCOS (TDK) | CAP FILM 0.22UF 20% 760VDC RAD | Dotaz |
|
B32912B3334M | EPCOS (TDK) | CAP FILM 0.33UF 20% 760VDC RAD | Dotaz |
|
B32912B3154M | EPCOS (TDK) | CAP FILM 0.15UF 20% 760VDC RAD | Dotaz |
 |
B32912B5822K | EPCOS (TDK) | CAP FILM 8200PF 10% 1KVDC RADIAL | Dotaz |
 |
B32912A5683M | EPCOS (TDK) | CAP FILM 0.068UF 20% 1KVDC RAD | Dotaz |
|
B32912B3154M289 | EPCOS (TDK) | CAP FILM 0.15UF 20% 760VDC RAD | Dotaz |
|
B32912A3473K189 | EPCOS (TDK) | CAP FILM 0.047UF 10% 760VDC RAD | Dotaz |
|
B32912A4473M | EPCOS (TDK) | CAP FILM 0.047UF 20% 440VAC RAD | Dotaz |
|
B32912B3154M189 | EPCOS (TDK) | CAP FILM 0.15UF 20% 760VDC RAD | Dotaz |
|
B32912B3224M189 | EPCOS (TDK) | CAP FILM 0.22UF 20% 760VDC RAD | Dotaz |
|
B32912B3224M289 | EPCOS (TDK) | CAP FILM 0.22UF 20% 760VDC RAD | Dotaz |
|
B32912A3104M | EPCOS (TDK) | CAP FILM 0.1UF 20% 760VDC RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers