Koupit B32674D6475J s BYCHPS
Koupit se zárukou
B32674D6475J
- Part Number:
- B32674D6475J
- Výrobce:
- EPCOS
- Popis:
- CAP FILM 4.7UF 5% 630VDC RADIAL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18140 Pieces
- Datový list:
- B32674D6475J.pdf
Úvod
BYCHIPS je distribuční odrůda pro B32674D6475J, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B32674D6475J e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napìtí - DC: | 630V |
|---|---|
| Napìtí - AC: | - |
| Tolerance: | ±5% |
| Ukončení: | PC Pins |
| Velikost / Rozměry: | 1.240" L x 0.866" W (31.50mm x 22.00mm) |
| Série: | B32674 |
| Obal: | Bulk |
| Paket / krabice: | Radial |
| Ostatní jména: | B32674D6475J000 |
| Provozní teplota: | -40°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B32674D6475J |
| Rozestup vývodù: | 1.083" (27.50mm) |
| Výška - Sedící (Max): | 1.437" (36.50mm) |
| Funkce: | Long Life |
| Rozšířený popis: | 4.7µF ±5% Film Capacitor 630V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Resistance Series): | 6 mOhm |
| dielektrikum Materiál: | Polypropylene (PP), Metallized |
| Popis: | CAP FILM 4.7UF 5% 630VDC RADIAL |
| kapacitní: | 4.7µF |
| Aplikace: | DC Link, DC Filtering |
| Email: | [email protected] |
Související díly pro B32674D6475J
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B32674D6475K | EPCOS (TDK) | CAP FILM 4.7UF 10% 630VDC RADIAL | Dotaz |
 |
B32674F1105K | EPCOS (TDK) | CAP FILM 1UF 10% 900VDC RADIAL | Dotaz |
|
B32674D6225J000 | EPCOS (TDK) | CAP FILM 2.2?F 5% 630VDC RADIAL | Dotaz |
|
B32674D3505J | EPCOS (TDK) | CAP FILM 5UF 5% 300VDC RADIAL | Dotaz |
|
B32674D6505K | EPCOS (TDK) | CAP FILM 5UF 10% 630VDC RADIAL | Dotaz |
|
B32674D8225J000 | EPCOS (TDK) | CAP FILM 2.2?F 5% 875VDC RADIAL | Dotaz |
|
B32674D3335K | EPCOS (TDK) | CAP FILM 3.3UF 10% 300VDC RADIAL | Dotaz |
|
B32674F4475K | EPCOS (TDK) | CAP FILM 4.7UF 10% 630VDC RADIAL | Dotaz |
|
B32674D1105K | EPCOS (TDK) | CAP FILM 1UF 10% 750VDC RADIAL | Dotaz |
|
B32674D3505K | EPCOS (TDK) | CAP FILM 5UF 10% 300VDC RADIAL | Dotaz |
|
B32674D6155K | EPCOS (TDK) | CAP FILM 1.5UF 10% 630VDC RADIAL | Dotaz |
|
B32674D8305K | EPCOS (TDK) | CAP FILM 3UF 10% 875VDC RADIAL | Dotaz |
|
B32674D6335K | EPCOS (TDK) | CAP FILM 3.3UF 10% 630VDC RADIAL | Dotaz |
|
B32674D6225K | EPCOS (TDK) | CAP FILM 2.2UF 10% 630VDC RADIAL | Dotaz |
|
B32674D6105K | EPCOS (TDK) | CAP FILM 1UF 10% 630VDC RADIAL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers