Koupit B32563J3105M000 s BYCHPS
Koupit se zárukou
B32563J3105M000
- Part Number:
- B32563J3105M000
- Výrobce:
- EPCOS
- Popis:
- FILM CAP MKT SILVER 1.0F 20% 250
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17427 Pieces
- Datový list:
- B32563J3105M000.pdf
Úvod
BYCHIPS je distribuční odrůda pro B32563J3105M000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B32563J3105M000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | B32563J3105M |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B32563J3105M000 |
| Rozšířený popis: | Film Capacitor |
| Popis: | FILM CAP MKT SILVER 1.0F 20% 250 |
| Email: | [email protected] |
Související díly pro B32563J3105M000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B32563J3105K | EPCOS (TDK) | CAP FILM 1UF 10% 250VDC 2DIP | Dotaz |
|
B32563J3155J | EPCOS (TDK) | CAP FILM 1.5UF 5% 250VDC 2DIP | Dotaz |
|
B32563J3105J | EPCOS (TDK) | CAP FILM 1UF 5% 250VDC 2DIP | Dotaz |
|
B32563J3225J | EPCOS (TDK) | CAP FILM 2.2UF 5% 250VDC 2DIP | Dotaz |
|
B32563J3684K | EPCOS (TDK) | CAP FILM 0.68UF 10% 250VDC 2DIP | Dotaz |
|
B32563J3475J | EPCOS (TDK) | CAP FILM 4.7UF 5% 250VDC 2DIP | Dotaz |
|
B32563J1475K | EPCOS (TDK) | CAP FILM 4.7UF 10% 100VDC 2DIP | Dotaz |
|
B32563J3475M000 | EPCOS (TDK) | CAP FILM 4.7UF 20% 250VDC 2DIP | Dotaz |
|
B32563J3335K | EPCOS (TDK) | CAP FILM 3.3UF 10% 250VDC 2DIP | Dotaz |
|
B32563J3475K | EPCOS (TDK) | CAP FILM 4.7UF 10% 250VDC 2DIP | Dotaz |
|
B32563J3225K | EPCOS (TDK) | CAP FILM 2.2UF 10% 250VDC 2DIP | Dotaz |
|
B32563J3155K | EPCOS (TDK) | CAP FILM 1.5UF 10% 250VDC 2DIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog