Koupit B32021A3252K000 s BYCHPS
Koupit se zárukou
B32021A3252K000
- Part Number:
- B32021A3252K000
- Výrobce:
- EPCOS
- Popis:
- FILM CAP Y2 MKP 2.5NF 10% 300VAC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16358 Pieces
- Datový list:
- B32021A3252K000.pdf
Úvod
BYCHIPS je distribuční odrůda pro B32021A3252K000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu B32021A3252K000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | B32021A3252K |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | B32021A3252K000 |
| Rozšířený popis: | Film Capacitor |
| Popis: | FILM CAP Y2 MKP 2.5NF 10% 300VAC |
| Email: | [email protected] |
Související díly pro B32021A3252K000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
B32021A3103M289 | EPCOS (TDK) | CAP FILM 10000PF 20% 1.5KVDC RAD | Dotaz |
 |
B32021A3272K000 | EPCOS (TDK) | FILM CAP Y2 MKP 2.7NF 10% 300VAC | Dotaz |
 |
B32021A3222K | EPCOS (TDK) | CAP FILM 2200PF 10% 1.5KVDC RAD | Dotaz |
|
B32021A3252M000 | EPCOS (TDK) | FILM CAP Y2 MKP 2.5NF 20% 300VAC | Dotaz |
|
B32021A3622K000 | EPCOS (TDK) | FILM CAP Y2 MKP 6.2 NF 10% 300VA | Dotaz |
|
B32021A3222K189 | EPCOS (TDK) | CAP FILM 2200PF 10% 300VAC RAD | Dotaz |
|
B32021A3222M189 | EPCOS (TDK) | CAP FILM 2200PF 20% 1.5KVDC RAD | Dotaz |
|
B32021A3222M | EPCOS (TDK) | CAP FILM 2200PF 20% 1.5KVDC RAD | Dotaz |
|
B32021A3102M289 | EPCOS (TDK) | CAP FILM 1000PF 20% 1.5KVDC RAD | Dotaz |
 |
B32021A3562M | EPCOS (TDK) | CAP FILM 5600PF 20% 1.5KVDC RAD | Dotaz |
|
B32021A3682K | EPCOS (TDK) | CAP FILM 6800PF 10% 1.5KVDC RAD | Dotaz |
|
B32021A3222M289 | EPCOS (TDK) | CAP FILM 2200PF 20% 1.5KVDC RAD | Dotaz |
|
B32021A3222K289 | EPCOS (TDK) | CAP FILM 2200PF 10% 300VAC RAD | Dotaz |
|
B32021A3272M000 | EPCOS (TDK) | FILM CAP Y2 MKP 2.7NF 20% 300VAC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers