Koupit APTDF100H100G s BYCHPS
Koupit se zárukou
APTDF100H100G
- Part Number:
- APTDF100H100G
- Výrobce:
- Microsemi
- Popis:
- DIODE MODULE FULL BRIDGE SP4
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18701 Pieces
- Datový list:
- 1.APTDF100H100G.pdf2.APTDF100H100G.pdf
Úvod
BYCHIPS je distribuční odrůda pro APTDF100H100G, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu APTDF100H100G e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Peak Reverse (Max): | 1000V |
|---|---|
| Napětí - Forward (VF) (Max) @-li: | 2.7V @ 100A |
| Technika: | Standard |
| Dodavatel zařízení Package: | SP4 |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | SP4 |
| Provozní teplota: | -40°C ~ 175°C (TJ) |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 22 Weeks |
| Výrobní číslo výrobce: | APTDF100H100G |
| Rozšířený popis: | Bridge Rectifier Single Phase 1000V 130A Chassis Mount SP4 |
| Diode Type: | Single Phase |
| Popis: | DIODE MODULE FULL BRIDGE SP4 |
| Proud - zpìtný únikový @ Vr: | 100µA @ 1000V |
| Proud - Průměrná Rektifikova (Io): | 130A |
| Email: | [email protected] |
Související díly pro APTDF100H100G
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
APTDF100H120G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Dotaz |
|
APTDF100H601G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP1 | Dotaz |
|
APTDF100H1201G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP1 | Dotaz |
|
APTDF100H20G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Dotaz |
|
APTDF100H170G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Dotaz |
|
APTDF100H60G | Microsemi Corporation | DIODE MODULE FULL BRIDGE SP4 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers