Koupit ALS71H432QC400 s BYCHPS
Koupit se zárukou
ALS71H432QC400
- Part Number:
- ALS71H432QC400
- Výrobce:
- KEMET
- Popis:
- ALU SCREW TERMINAL 4300UF 400V
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12028 Pieces
- Datový list:
- ALS71H432QC400.pdf
Úvod
BYCHIPS je distribuční odrůda pro ALS71H432QC400, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ALS71H432QC400 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 13 Weeks |
| Výrobní číslo výrobce: | ALS71H432QC400 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | ALU SCREW TERMINAL 4300UF 400V |
| Email: | [email protected] |
Související díly pro ALS71H432QC400
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ALS71H432LM450 | KEMET | ALU SCREW TERMINAL 4300UF 450V | Dotaz |
|
ALS71H472KE200 | KEMET | ALU SCREW TERMINAL 4700UF 200V | Dotaz |
|
ALS71H432NJ550 | KEMET | ALU SCREW TERMINAL 4300UF 550V | Dotaz |
|
ALS71H473QS200 | KEMET | ALU SCREW TERMINAL 47000UF 200V | Dotaz |
|
ALS71H432DB100 | KEMET | ALU SCREW TERMINAL 4300UF 100V | Dotaz |
|
ALS71H432MF450 | KEMET | ALU SCREW TERMINAL 4300UF 450V | Dotaz |
|
ALS71H474NF025 | KEMET | ALU SCREW TERMINAL 470000UF 25V | Dotaz |
|
ALS71H431DA450 | KEMET | ALU SCREW TERMINAL 430UF 450V | Dotaz |
|
ALS71H472QH550 | KEMET | ALU SCREW TERMINAL 4700UF 550V | Dotaz |
|
ALS71H434NW040 | KEMET | ALU SCREW TERMINAL 430000UF 40V | Dotaz |
|
ALS71H473QT200 | KEMET | ALU SCREW TERMINAL 47000UF 200V | Dotaz |
|
ALS71H474NJ025 | KEMET | ALU SCREW TERMINAL 470000UF 25V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers