Koupit AK8996W s BYCHPS
Koupit se zárukou
AK8996W
- Part Number:
- AK8996W
- Popis:
- IC INTERFACE PRESS SENSOR WAFER
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12945 Pieces
- Datový list:
- AK8996W.pdf
Úvod
BYCHIPS je distribuční odrůda pro AK8996W, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu AK8996W e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Interface |
|---|---|
| Dodavatel zařízení Package: | Wafer |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | Die |
| Typ výstupu: | Analog Voltage |
| Provozní teplota: | -40°C ~ 105°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | AK8996W |
| Rozhraní: | Serial |
| Typ vstupu: | Analog Voltage |
| Popis: | IC INTERFACE PRESS SENSOR WAFER |
| Proud - Supply: | 2.85mA |
| Email: | [email protected] |
Související díly pro AK8996W
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
AK8998W | AKM Semiconductor Inc. | IC INTERFACE PRESS SENSOR WAFER | Dotaz |
 |
LDS7000NQGI | IDT, Integrated Device Technology Inc | IC TOUCH SCREEN CTRLR 40TQFN | Dotaz |
 |
E-L9634TR | STMicroelectronics | IC DRIVER ISO 9141 8SOIC | Dotaz |
 |
RE46C101E8F | Microchip Technology | IC HORN DRIVER DUAL 8DIP | Dotaz |
 |
AK8996 | AKM Semiconductor Inc. | IC INTERFACE PRESS SENSOR 16UQFN | Dotaz |
|
AK8998 | AKM Semiconductor Inc. | IC INTERFACE PRESS SENSOR QFN | Dotaz |
 |
MAX3983UGK+D | Maxim Integrated | IC SIGNAL COND QUAD 68-QFN | Dotaz |
 |
SX8724E082TDT | Semtech Corporation | IC DAS PRESS/TEMP SENS 16MLPQ | Dotaz |
 |
AC1226 | Analog Devices Inc. | IC THERMOCOUPLE COMPENSATOR 8DIP | Dotaz |
|
AK8998D | AKM Semiconductor Inc. | IC INTERFACE PRESS SENSOR DIE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers