Koupit AGLN010V5-UCG36I s BYCHPS
Koupit se zárukou
AGLN010V5-UCG36I
- Part Number:
- AGLN010V5-UCG36I
- Výrobce:
- Microsemi
- Popis:
- IC FPGA 23 I/O 36UCSP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17920 Pieces
- Datový list:
- AGLN010V5-UCG36I.pdf
Úvod
BYCHIPS je distribuční odrůda pro AGLN010V5-UCG36I, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu AGLN010V5-UCG36I e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 1.425 V ~ 1.575 V |
|---|---|
| Dodavatel zařízení Package: | 36-UCSP (3x3) |
| Série: | IGLOO nano |
| Paket / krabice: | 36-WFBGA, CSBGA |
| Provozní teplota: | -40°C ~ 100°C (TJ) |
| Počet logických prvků / buněk: | 260 |
| Počet I / O: | 23 |
| Počet Gates: | 10000 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 18 Weeks |
| Výrobní číslo výrobce: | AGLN010V5-UCG36I |
| Popis: | IC FPGA 23 I/O 36UCSP |
| Email: | [email protected] |
Související díly pro AGLN010V5-UCG36I
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
AGLN010V5-QNG48 | Microsemi Corporation | IC FPGA 34 I/O 48QFN | Dotaz |
 |
AGLN010V5-UCG36 | Microsemi Corporation | IC FPGA 23 I/O 36UCSP | Dotaz |
|
AGLN010V2-UCG36 | Microsemi Corporation | IC FPGA 23 I/O 36UCSP | Dotaz |
|
AGLN010V2-QNG48I | Microsemi Corporation | IC FPGA 34 I/O 48QFN | Dotaz |
|
AGLN010V2-UCG36I | Microsemi Corporation | IC FPGA 23 I/O 36UCSP | Dotaz |
|
AGLN010V2-QNG48 | Microsemi Corporation | IC FPGA 34 I/O 48QFN | Dotaz |
|
AGLN010V5-QNG48I | Microsemi Corporation | IC FPGA 34 I/O 48QFN | Dotaz |
 |
AGLN015V2-QNG68I | Microsemi Corporation | IC FPGA 49 I/O 68QFN | Dotaz |
|
AGLN015V5-QNG68 | Microsemi Corporation | IC FPGA 49 I/O 68QFN | Dotaz |
|
AGLN015V5-QNG68I | Microsemi Corporation | IC FPGA 49 I/O 68QFN | Dotaz |
|
AGLN015V2-QNG68 | Microsemi Corporation | IC FPGA 49 I/O 68QFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers