Koupit ACB1608H-030-T s BYCHPS
Koupit se zárukou
ACB1608H-030-T
- Part Number:
- ACB1608H-030-T
- Výrobce:
- TDK Corporation
- Popis:
- FERRITE BEAD 30 OHM 0603 1LN
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 12411 Pieces
- Datový list:
- ACB1608H-030-T.pdf
Úvod
BYCHIPS je distribuční odrůda pro ACB1608H-030-T, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ACB1608H-030-T e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
|---|---|
| Série: | ACB |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 0603 (1608 Metric) |
| Provozní teplota: | - |
| Počet řádků: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | ACB1608H-030-T |
| Impedance @ Frekvence: | 30 Ohm @ 100MHz |
| Výška (Max): | 0.043" (1.10mm) |
| Typ filtru: | Signal Line |
| Popis: | FERRITE BEAD 30 OHM 0603 1LN |
| DC odpor (DCR) (Max): | 400 mOhm |
| Karta Tloušťka (mm): | 300mA |
| Email: | [email protected] |
Související díly pro ACB1608H-030-T
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ACB1608M-080-T | TDK Corporation | FERRITE BEAD 80 OHM 0603 1LN | Dotaz |
|
ACB1608L-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0603 1LN | Dotaz |
|
ACB1608H-060-T | TDK Corporation | FERRITE BEAD 60 OHM 0603 1LN | Dotaz |
|
ACB1608L-060-T | TDK Corporation | FERRITE BEAD 60 OHM 0603 1LN | Dotaz |
|
ACB1608L-030-T | TDK Corporation | FERRITE BEAD 30 OHM 0603 1LN | Dotaz |
|
ACB1608H-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0603 1LN | Dotaz |
|
ACB1608M-040-T | TDK Corporation | FERRITE BEAD 40 OHM 0603 1LN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers