Koupit 83500000005 s BYCHPS
Koupit se zárukou
83500000005
- Part Number:
- 83500000005
- Výrobce:
- Littelfuse
- Popis:
- CAP FOR 5X20MM FUSES FLUSH MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12407 Pieces
- Datový list:
- 83500000005.pdf
Úvod
BYCHIPS je distribuční odrůda pro 83500000005, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 83500000005 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Ostatní jména: | 8350000000 8350000000-ND 83500000000 WK6234 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 11 Weeks |
| Výrobní číslo výrobce: | 83500000005 |
| Pro použití s / příbuzné výrobky: | Fuseholder; 834 |
| Popis: | CAP FOR 5X20MM FUSES FLUSH MOUNT |
| Typ příslušenství: | Cap (Cover) |
| Email: | [email protected] |
Související díly pro 83500000005
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
0695900.PX4 | Littelfuse Inc. | SHUNT MCASE 32V 2 | Dotaz |
|
83500000205 | Littelfuse Inc. | FUSEHOLDER CAP FOR 824-20 WHITE | Dotaz |
 |
64800001009 | Littelfuse Inc. | FUSEBLOCK COVER FOR 646/647 CLR | Dotaz |
|
09130900Z | Littelfuse Inc. | TERMINAL SPECIALLY FOR FPA | Dotaz |
|
LRU2642R | Littelfuse Inc. | FUSE REDUCER CLASS R 400 TO 200A | Dotaz |
 |
1423696-6 | TE Connectivity Potter & Brumfield Relays | HEX NUT M11-1 | Dotaz |
 |
2920023 | Phoenix Contact | BASE ELEMENT | Dotaz |
 |
GV2G472A46 | Eaton | COMB BAR 4POS 72MM OPM FUSE HLDR | Dotaz |
 |
255.0808.0001 | Littelfuse Inc. | INSULATION NUT CF FUSE M8 BOLT | Dotaz |
|
2A1702-10 | Eaton | LINE SIDE DEAD FRONT ASSEMBLY | Dotaz |
 |
9970620000 | Weidmuller | DIN RAIL CQB4 ANGLE COMB 2/IP | Dotaz |
 |
0853.1201 | Schurter Inc. | FUSE CARRIER OGN 5X20MM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers