Koupit 74LVT16374AEVE s BYCHPS
Koupit se zárukou
74LVT16374AEVE
- Part Number:
- 74LVT16374AEVE
- Výrobce:
- NXP Semiconductors / Freescale
- Popis:
- IC D-TYPE POS TRG DUAL 56VFBGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15940 Pieces
- Datový list:
- 74LVT16374AEVE.pdf
Úvod
BYCHIPS je distribuční odrůda pro 74LVT16374AEVE, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 74LVT16374AEVE e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Typ: | D-Type |
| Trigger Type: | Positive Edge |
| Série: | 74LVT |
| Obal: | Tray |
| Paket / krabice: | 56-VFBGA |
| Typ výstupu: | Tri-State |
| Ostatní jména: | 935271933551 |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Počet elementů: | 2 |
| Počet bitů na Element: | 8 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 2 (1 Year) |
| Max prodlení propagace @ V, Max CL: | 5ns @ 3.3V, 50pF |
| Výrobní číslo výrobce: | 74LVT16374AEVE |
| Vstupní kapacita: | 3pF |
| Funkce: | Standard |
| Popis: | IC D-TYPE POS TRG DUAL 56VFBGA |
| Proud - Klidový: | 4µA |
| Aktuální - Výstup High, Low: | 32mA, 64mA |
| Frekvence hodin: | 150MHz |
| Email: | [email protected] |
Související díly pro 74LVT16374AEVE
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
74LVT16374AEV,151 | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEV/G:55 | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEV,118 | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
 |
74LVT16374AEVK | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEV/G,55 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEVY | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEV/G,51 | Nexperia USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
|
74LVT16374AEV,157 | NXP USA Inc. | IC D-TYPE POS TRG DUAL 56VFBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers