Koupit 73L-II420 s BYCHPS
Koupit se zárukou
73L-II420
- Part Number:
- 73L-II420
- Výrobce:
- Grayhill, Inc.
- Popis:
- I/O MODULE 4-20MA 12-BIT;3.91UA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15044 Pieces
- Datový list:
- 73L-II420.pdf
Úvod
BYCHIPS je distribuční odrůda pro 73L-II420, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 73L-II420 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Input, Current |
|---|---|
| Styl: | OpenLine® |
| Série: | 73 |
| Serial Data Format: | Right Justified, 16-bit |
| Rozlišení: | 12-bit; 3.91µA/count |
| Počet vstupů a výstupů: | 2 Channel, Single Ended |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Type module: | 4 ~ 20mA |
| Výrobní číslo výrobce: | 73L-II420 |
| Logic napětí: | 5VDC (4.75 ~ 5.25VDC) |
| Rozšířený popis: | Analog Input, Current Module 2 Channel, Single Ended 4 ~ 20mA |
| Popis: | I/O MODULE 4-20MA 12-BIT;3.91UA |
| Barva: | Gray |
| Email: | [email protected] |
Související díly pro 73L-II420
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
73L-ITR100 | Grayhill Inc. | I/O MODULE RTD, 2 WIRE 12-BIT | Dotaz |
|
73L-IV50M | Grayhill Inc. | I/O MODULE 0-50MV 12-BIT;12.20UV | Dotaz |
|
73L-OV5 | Grayhill Inc. | I/O MODULE 0-5VDC 12-BIT;1.22MV | Dotaz |
|
73L-II020 | Grayhill Inc. | I/O MODULE 0-20MA 12-BIT;4.88UA | Dotaz |
|
73L-OI024 | Grayhill Inc. | I/O MODULE 0-24MA 12-BIT;5.90UA | Dotaz |
|
73L-OI420 | Grayhill Inc. | I/O MODULE 4-20MA 12-BIT;3.90UA | Dotaz |
|
73L-IV10 | Grayhill Inc. | I/O MODULE 0-10VDC 12-BIT;2.44MV | Dotaz |
|
73L-ITR4100 | Grayhill Inc. | I/O MODULE RTD, 4 WIRE 12-BIT | Dotaz |
|
73L-IV5 | Grayhill Inc. | I/O MODULE 0-5VDC 12-BIT;1.22MV | Dotaz |
|
73L-IV1 | Grayhill Inc. | I/O MODULE 0-1VDC 12-BIT;244.10U | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers