Koupit 6R3R15X476MV4E s BYCHPS
Koupit se zárukou
6R3R15X476MV4E
- Part Number:
- 6R3R15X476MV4E
- Výrobce:
- Johanson Dielectrics, Inc.
- Popis:
- CAP CER 47UF 6.3V X5R 0805
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19676 Pieces
- Datový list:
- 6R3R15X476MV4E.pdf
Úvod
BYCHIPS je distribuční odrůda pro 6R3R15X476MV4E, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 6R3R15X476MV4E e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | 6R3R15X476MV4E |
| Rozšířený popis: | Ceramic Capacitor |
| Popis: | CAP CER 47UF 6.3V X5R 0805 |
| Email: | [email protected] |
Související díly pro 6R3R15X476MV4E
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
6R3R15X226KV4E | Johanson Dielectrics Inc. | CAP CER 22UF 6.3V X5R 0805 | Dotaz |
 |
6R3R14X106MV4T | Johanson Dielectrics Inc. | CAP CER 10UF 6.3V X5R 0603 | Dotaz |
|
6R3R15X106MV4E | Johanson Dielectrics Inc. | CAP CER 10UF 6.3V X5R 0805 | Dotaz |
|
6R3R15X226MV4E | Johanson Dielectrics Inc. | CAP CER 22UF 6.3V X5R 0805 | Dotaz |
 |
1210Y0160101GCT | Knowles Syfer | CAP CER 1210 | Dotaz |
|
6R3R15X475KV4E | Johanson Dielectrics Inc. | CAP CER 4.7UF 6.3V X5R 0805 | Dotaz |
 |
6R3R18X476MV4E | Johanson Dielectrics Inc. | CAP CER 47UF 6.3V X5R 1206 | Dotaz |
|
6R3R18X226KV4E | Johanson Dielectrics Inc. | CAP CER 22UF 6.3V X5R 1206 | Dotaz |
|
6R3R18X335KV4E | Johanson Dielectrics Inc. | CAP CER 3.3UF 6.3V X5R 1206 | Dotaz |
|
6R3R15X106KV4E | Johanson Dielectrics Inc. | CAP CER 10UF 6.3V X5R 0805 | Dotaz |
|
6R3R14X475KV4T | Johanson Dielectrics Inc. | CAP CER 4.7UF 6.3V X5R 0603 | Dotaz |
|
6R3R14X475MV4T | Johanson Dielectrics Inc. | CAP CER 4.7UF 6.3V X5R 0603 | Dotaz |
 |
6R3R18X106KV4E | Johanson Dielectrics Inc. | CAP CER 10UF 6.3V X5R 1206 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers