Koupit 63USC3300MEFCSN25X30 s BYCHPS
Koupit se zárukou
63USC3300MEFCSN25X30
- Part Number:
- 63USC3300MEFCSN25X30
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM 3300UF 20% 63V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16787 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 63USC3300MEFCSN25X30, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 63USC3300MEFCSN25X30 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 63V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 0.984" Dia (25.00mm) |
| Série: | USC |
| Ripple Current: | 2.69A @ 120Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Provozní teplota: | -40°C ~ 85°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 63USC3300MEFCSN25X30 |
| Životnost @ Temp.: | 3000 Hrs @ 85°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 1.260" (32.00mm) |
| Rozšířený popis: | 3300µF 63V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 85°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 3300UF 20% 63V SNAP |
| kapacitní: | 3300µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro 63USC3300MEFCSN25X30
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
63USC2200MEFC20X35 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63USC12000MEFC35X45 | Rubycon | CAP ALUM 12000UF 20% 63V SNAP | Dotaz |
|
63USC3300MEFC25X30 | Rubycon | CAP ALUM 3300UF 20% 63V SNAP | Dotaz |
 |
63USC2200MEFCSN20X35 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63USC2200MEFC22X30 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63USC10000MEFC30X50 | Rubycon | CAP ALUM 10000UF 20% 63V SNAP | Dotaz |
 |
63USC4700MEFCSN30X30 | Rubycon | CAP ALUM 4700UF 20% 63V SNAP | Dotaz |
|
63USC1800MEFC20X30 | Rubycon | CAP ALUM 1800UF 20% 63V SNAP | Dotaz |
 |
63USC4700MEFCSN22X50 | Rubycon | CAP ALUM 4700UF 20% 63V SNAP | Dotaz |
|
63USC2200MEFCSN22X30 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
 |
63USC10000MEFCSN35X40 | Rubycon | CAP ALUM 10000UF 20% 63V SNAP | Dotaz |
|
63USC3900MEFC25X35 | Rubycon | CAP ALUM 3900UF 20% 63V SNAP | Dotaz |
 |
63USC4700MEFCSN25X40 | Rubycon | CAP ALUM 4700UF 20% 63V SNAP | Dotaz |
|
63USC10000MEFC35X40 | Rubycon | CAP ALUM 10000UF 20% 63V SNAP | Dotaz |
 |
63USC6800MEFCSN35X30 | Rubycon | CAP ALUM 6800UF 20% 63V SNAP | Dotaz |
|
63USC4700MEFC30X30 | Rubycon | CAP ALUM 4700UF 20% 63V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers