Koupit 6015 s BYCHPS
Koupit se zárukou
Úvod
BYCHIPS je distribuční odrůda pro 6015, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 6015 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | 200, 210, 270 |
|---|---|
| Ostatní jména: | OH6015 |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | 6015 |
| Pro použití s / příbuzné výrobky: | Ohmite 200, 210, 270 Series Resistors |
| Popis: | WASHER, MICA D85809 BAG OF 100 |
| Typ příslušenství: | Washer |
| Email: | [email protected] |
Související díly pro 6015
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
6010 | Ohmite | WASHER, MICA D85849 BAG OF 100 | Dotaz |
|
6012E | Ohmite | WASHER, MICA D85847 BAG OF 100 | Dotaz |
|
6015E | Ohmite | WASHER, MICA D85809 BAG OF 100 | Dotaz |
|
6012 | Ohmite | WASHER, MICA D85847 BAG OF 100 | Dotaz |
|
6013E | Ohmite | WASHER, MICA D85812 BAG OF 100 | Dotaz |
|
6014E | Ohmite | WASHER, MICA D85845 BAG OF 100 | Dotaz |
|
6017 | Ohmite | WASHER, MICA D85804 BAG OF 100 | Dotaz |
|
6014 | Ohmite | WASHER, MICA D85845 BAG OF 100 | Dotaz |
|
6011E | Ohmite | WASHER, MICA D85823 BAG OF 100 | Dotaz |
|
6013 | Ohmite | WASHER, MICA D85812 BAG OF 100 | Dotaz |
|
6016 | Ohmite | WASHER, MICA D85843 BAG OF 100 | Dotaz |
|
6017E | Ohmite | WASHER, MICA D85804 BAG OF 100 | Dotaz |
|
6010E | Ohmite | WASHER, MICA D85849 BAG OF 100 | Dotaz |
|
6016E | Ohmite | WASHER, MICA D85843 BAG OF 100 | Dotaz |
|
5904 | Ohmite | MOUNTING CLIPS D8212-4 | Dotaz |
|
6011 | Ohmite | WASHER, MICA D85823 BAG OF 100 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers