Koupit 4861-01 s BYCHPS
Koupit se zárukou
4861-01
- Part Number:
- 4861-01
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE CLIP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15309 Pieces
- Datový list:
- 4861-01.pdf
Úvod
BYCHIPS je distribuční odrůda pro 4861-01, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 4861-01 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 13 Weeks |
| Výrobní číslo výrobce: | 4861-01 |
| Rozšířený popis: | Fuse Circuit |
| Popis: | FUSE CLIP |
| Email: | [email protected] |
Související díly pro 4861-01
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
HKP-E-HH | Eaton | FUSE HOLDER 250V | Dotaz |
 |
0LEX0BBSX | Littelfuse Inc. | FUSE HLDR CART 600V 30A IN LINE | Dotaz |
|
BK/S-8202-10-R | Eaton | FUSE BLOCK CART 300V CHASS MNT | Dotaz |
 |
LPHV0003Z | Littelfuse Inc. | FUSE HLDR CART 1000V 30A DINRAIL | Dotaz |
|
HET-JW-RYC | Eaton | FUSE HOLDER CARTRIDGE IN LINE | Dotaz |
 |
3101.0060 | Schurter Inc. | FUSE HLDR CART 400V 16A PNL MNT | Dotaz |
 |
03420004H | Littelfuse Inc. | FUSE HLDR CART 250V 20A PNL MNT | Dotaz |
|
H25400-3CR | Eaton | FUSE BLOK CART 250V 400A CHASSIS | Dotaz |
 |
05710RCCLXP | Littelfuse Inc. | FUSE HLDR CART 600V 30A PNL MNT | Dotaz |
|
0032.1108 | Schurter Inc. | FUSE HLDR CART 250V 6.3A PNL MNT | Dotaz |
|
279.6850.2502 | Littelfuse Inc. | FUSE HOLDER BLADE 80A IN LINE | Dotaz |
|
LT300602CR | Littelfuse Inc. | FUSE BLOCK CART 300V 60A CHASSIS | Dotaz |
|
BK/S-8101-1-SNP | Eaton | FUSE BLOCK CART 300V CHASS MNT | Dotaz |
|
03540604ZXGY | Littelfuse Inc. | FUSE BLOCK CART 600V 20A CHASSIS | Dotaz |
 |
03420838HXP | Littelfuse Inc. | FUSE HLDR CART 250V 20A PNL MNT | Dotaz |
 |
01070002Z | Littelfuse Inc. | FUSE CLIP CART 250V 30A CHASSIS | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers