Koupit 4608X-104-221/271 s BYCHPS
Koupit se zárukou
4608X-104-221/271
- Part Number:
- 4608X-104-221/271
- Výrobce:
- Bourns, Inc.
- Popis:
- RES NETWORK 12 RES MULT OHM 8SIP
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 12515 Pieces
- Datový list:
- 4608X-104-221/271.pdf
Úvod
BYCHIPS je distribuční odrůda pro 4608X-104-221/271, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 4608X-104-221/271 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Tolerance: | ±2% |
|---|---|
| teplotní koeficient: | ±100ppm/°C |
| Dodavatel zařízení Package: | 8-SIP |
| Velikost / Rozměry: | 0.798" L x 0.098" W (20.27mm x 2.49mm) |
| Série: | 4600X |
| Odpor (Ohm): | 220, 270 |
| Power Per Element: | 200mW |
| Obal: | Bulk |
| Paket / krabice: | 8-SIP |
| Ostatní jména: | 4608X-4-221/271 |
| Provozní teplota: | -55°C ~ 125°C |
| Počet rezistory: | 12 |
| Počet Pins: | 8 |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | 4608X-104-221/271 |
| Výška - Sedící (Max): | 0.200" (5.08mm) |
| Rozšířený popis: | 220, 270 Ohm ±2% 200mW Power Per Element Dual Terminator Resistor Network/Array ±100ppm/°C 8-SIP |
| Popis: | RES NETWORK 12 RES MULT OHM 8SIP |
| Typ obvodu: | Dual Terminator |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro 4608X-104-221/271
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
4608X-102-682LF | Bourns Inc. | RES ARRAY 4 RES 6.8K OHM 8SIP | Dotaz |
|
4608X-104-471/681L | Bourns Inc. | RES NETWORK 12 RES MULT OHM 8SIP | Dotaz |
|
4608X-102-180LF | Bourns Inc. | RES ARRAY 4 RES 18 OHM 8SIP | Dotaz |
|
4608X-AP2-330LF | Bourns Inc. | RES ARRAY 4 RES 33 OHM 8SIP | Dotaz |
|
4608X-102-152LF | Bourns Inc. | RES ARRAY 4 RES 1.5K OHM 8SIP | Dotaz |
|
4608X-102-103LF | Bourns Inc. | RES ARRAY 4 RES 10K OHM 8SIP | Dotaz |
|
4608X-101-823 | Bourns Inc. | RES ARRAY 7 RES 82K OHM 8SIP | Dotaz |
|
4608X-102-123LF | Bourns Inc. | RES ARRAY 4 RES 12K OHM 8SIP | Dotaz |
|
4608X-101-203LF | Bourns Inc. | RES ARRAY 7 RES 20K OHM 8SIP | Dotaz |
|
4608X-102-121 | Bourns Inc. | RES ARRAY 4 RES 120 OHM 8SIP | Dotaz |
|
4608X-104-331/471 | Bourns Inc. | RES NETWORK 12 RES MULT OHM 8SIP | Dotaz |
|
4608X-101-124 | Bourns Inc. | RES ARRAY 7 RES 120K OHM 8SIP | Dotaz |
|
4608X-101-151LF | Bourns Inc. | RES ARRAY 7 RES 150 OHM 8SIP | Dotaz |
|
4608X-101-182 | Bourns Inc. | RES ARRAY 7 RES 1.8K OHM 8SIP | Dotaz |
|
4608X-102-223LF | Bourns Inc. | RES ARRAY 4 RES 22K OHM 8SIP | Dotaz |
|
4608X-102-220LF | Bourns Inc. | RES ARRAY 4 RES 22 OHM 8SIP | Dotaz |
|
4608X-102-273LF | Bourns Inc. | RES ARRAY 4 RES 27K OHM 8SIP | Dotaz |
|
4608X-101-471 | Bourns Inc. | RES ARRAY 7 RES 470 OHM 8SIP | Dotaz |
|
4608X-102-122 | Bourns Inc. | RES ARRAY 4 RES 1.2K OHM 8SIP | Dotaz |
|
4608X-AP2-102LF | Bourns Inc. | RES ARRAY 4 RES 1K OHM 8SIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers