Koupit 4164G-FRSS-SEAL s BYCHPS
Koupit se zárukou
4164G-FRSS-SEAL
- Part Number:
- 4164G-FRSS-SEAL
- Výrobce:
- Bussmann (Eaton)
- Popis:
- SPECIAL BUSS FUSEBLOCK
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12636 Pieces
- Datový list:
- 4164G-FRSS-SEAL.pdf
Úvod
BYCHIPS je distribuční odrůda pro 4164G-FRSS-SEAL, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 4164G-FRSS-SEAL e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 5 Weeks |
| Výrobní číslo výrobce: | 4164G-FRSS-SEAL |
| Rozšířený popis: | Fuse Circuit |
| Popis: | SPECIAL BUSS FUSEBLOCK |
| Email: | [email protected] |
Související díly pro 4164G-FRSS-SEAL
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
02820002ZXA | Littelfuse Inc. | FUSE HLDR RADIAL 125V 5A PNL MNT | Dotaz |
 |
0913055001 | Littelfuse Inc. | ISO MREL FLSH TERM 3.32-5.37M | Dotaz |
 |
CHCC1DI-48U | Eaton | FUSE HOLDR CART 48V 30A DIN RAIL | Dotaz |
|
00940303Z | Littelfuse Inc. | ACS JBR BRD ATO HD INLN FSHLDR | Dotaz |
 |
BK/HTB-38I-R | Eaton | FUSE HLDR CART 250V 20A PNL MNT | Dotaz |
 |
03420848HXL | Littelfuse Inc. | FUSE HLDR CART 250V 20A PNL MNT | Dotaz |
|
0FHM0003ZXJD | Littelfuse Inc. | FUSE HLDR BLADE 32V 20A IN LINE | Dotaz |
|
04980905ZXT | Littelfuse Inc. | MIDI FUSE HOLDER | Dotaz |
|
0FHA0002ZXJA | Littelfuse Inc. | FUSE HLDR BLADE 32V 30A IN LINE | Dotaz |
 |
HMEG | Eaton | FUSE HOLDER BLADE 300A CHASS MNT | Dotaz |
|
0HBF0002ZXBASE1 | Littelfuse Inc. | FUSE HLDR BLT DWN 32V 200A PANEL | Dotaz |
 |
BK/HTB-92I-R | Eaton | FUSE HLDR CART 250V 20A PNL MNT | Dotaz |
|
HLS-10-ML | Eaton | FUSE BLOCK BLADE 125V 15A PCB | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers