Koupit 2SC4915-Y,LF s BYCHPS
Koupit se zárukou
2SC4915-Y,LF
- Part Number:
- 2SC4915-Y,LF
- Výrobce:
- Toshiba Semiconductor
- Popis:
- TRANS RF NPN 30V 550MHZ SSM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12476 Pieces
- Datový list:
- 2SC4915-Y,LF.pdf
Úvod
BYCHIPS je distribuční odrůda pro 2SC4915-Y,LF, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 2SC4915-Y,LF e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 30V |
|---|---|
| Transistor Type: | NPN |
| Dodavatel zařízení Package: | SSM |
| Série: | - |
| Power - Max: | 100mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | SC-75, SOT-416 |
| Ostatní jména: | 2SC4915-Y,LF(T 2SC4915-YLFTR |
| Provozní teplota: | 125°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | 2.3dB ~ 5dB @ 100MHz |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | 2SC4915-Y,LF |
| Získat: | 17dB ~ 23dB |
| Frekvence - Přechod: | 550MHz |
| Rozšířený popis: | RF Transistor NPN 30V 20mA 550MHz 100mW Surface Mount SSM |
| Popis: | TRANS RF NPN 30V 550MHZ SSM |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 100 @ 1mA, 6V |
| Proud - Collector (Ic) (Max): | 20mA |
| Email: | [email protected] |
Související díly pro 2SC4915-Y,LF
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2SC4915-O,LF | Toshiba Semiconductor and Storage | TRANS RF NPN 30V 550MHZ SSM | Dotaz |
 |
2SC4935-Y,Q(J | Toshiba Semiconductor and Storage | TRANS NPN 3A 50V TO220-3 | Dotaz |
 |
2SC4944-Y(TE85L,F) | Toshiba Semiconductor and Storage | TRANS 2NPN 50V 0.15A USV | Dotaz |
 |
NE677M04-T2-A | CEL | RF TRANSISTOR NPN SOT-343F | Dotaz |
 |
MRF5812G | Microsemi Corporation | TRANS NPN 15V 200MA SO8 | Dotaz |
|
2SC4944-GR(TE85L,F | Toshiba Semiconductor and Storage | TRANS NPN 50V 0.15A USV | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers