Koupit 28R2000-010 s BYCHPS
Koupit se zárukou
28R2000-010
- Part Number:
- 28R2000-010
- Popis:
- FERRITE CORE 170 OHM SOLID
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12892 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 28R2000-010, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 28R2000-010 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Flat |
|---|---|
| Série: | 28 |
| hodnocení: | - |
| Vnější rozměr: | 2.000" W x 0.480" H (50.80mm x 12.20mm) |
| Ostatní jména: | 240-2338 |
| Typ montáže: | Free Hanging |
| Materiál: | 28 |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | 28R2000-010 |
| Délka: | 0.598" (15.20mm) |
| Vnitřní rozměr: | 1.600" W x 0.079" H (40.60mm x 2.00mm) |
| Impedance @ Frekvence: | 170 Ohm @ 100MHz |
| Rozšířený popis: | Solid Free Hanging Ferrite Core 170 Ohm @ 100MHz ID 1.600" W x 0.079" H (40.60mm x 2.00mm) OD 2.000" W x 0.480" H (50.80mm x 12.20mm) Length 0.598" (15.20mm) |
| Design: | Solid |
| Popis: | FERRITE CORE 170 OHM SOLID |
| Email: | [email protected] |
Související díly pro 28R2000-010
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
7427801 | Wurth Electronics Inc. | FERRITE CORE 79 OHM SOLID | Dotaz |
 |
742700221 | Wurth Electronics Inc. | FERRITE CORE 45 OHM SOLID 4MM | Dotaz |
 |
ZCAT4625-3430D-BK | TDK Corporation | FERRITE CORE 35 OHM HINGED | Dotaz |
 |
28B0686-100 | Laird-Signal Integrity Products | FERRITE CORE 139 OHM SOLID | Dotaz |
 |
74278041 | Wurth Electronics Inc. | FERRITE CORE 20 OHM SOLID | Dotaz |
 |
HFB075025-000 | Laird-Signal Integrity Products | FERRITE CORE 157 OHM SOLID | Dotaz |
 |
28R2000-200 | Laird-Signal Integrity Products | FERRITE CORE 252 OHM SOLID | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers