Koupit 28B0250-000 s BYCHPS
Koupit se zárukou
28B0250-000
- Part Number:
- 28B0250-000
- Popis:
- FERRITE CORE 150 OHM SOLID
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19289 Pieces
- Datový list:
- 1.28B0250-000.pdf2.28B0250-000.pdf
Úvod
BYCHIPS je distribuční odrůda pro 28B0250-000, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 28B0250-000 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Round |
|---|---|
| Série: | 28 |
| hodnocení: | - |
| Vnější rozměr: | 0.250" Dia (6.35mm) |
| Ostatní jména: | 240-2288 |
| Typ montáže: | Free Hanging |
| Materiál: | 28 |
| Výrobní číslo výrobce: | 28B0250-000 |
| Délka: | 0.500" (12.70mm) |
| Vnitřní rozměr: | 0.125" Dia (3.18mm) |
| Impedance @ Frekvence: | 150 Ohm @ 100MHz |
| Rozšířený popis: | Solid Free Hanging Ferrite Core 150 Ohm @ 100MHz ID 0.125" Dia (3.18mm) OD 0.250" Dia (6.35mm) Length 0.500" (12.70mm) |
| Design: | Solid |
| Popis: | FERRITE CORE 150 OHM SOLID |
| Email: | [email protected] |
Související díly pro 28B0250-000
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
28B0275-000 | Laird-Signal Integrity Products | FERRITE CORE 146 OHM SOLID 3.8MM | Dotaz |
 |
28B0250-700 | Laird-Signal Integrity Products | FERRITE CORE 135 OHM SOLID | Dotaz |
 |
KR16TT160918 | Panasonic - DTG | FERRITE CORE 110 OHM SOLID 9MM | Dotaz |
 |
28B0250-100 | Laird-Signal Integrity Products | FERRITE CORE 182 OHM SOLID | Dotaz |
|
28R1024-000 | Laird-Signal Integrity Products | FERRITE CORE 128 OHM SOLID | Dotaz |
|
28R1022-000 | Laird-Signal Integrity Products | FERRITE CORE 91 OHM SOLID | Dotaz |
 |
28B0268-000 | Laird-Signal Integrity Products | FERRITE CORE 138 OHM SOLID | Dotaz |
 |
74270053 | Wurth Electronics Inc. | FERRITE CORE 258 OHM SOLID 8MM | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers