Koupit 2817987 s BYCHPS
Koupit se zárukou
2817987
- Part Number:
- 2817987
- Výrobce:
- Phoenix Contact
- Popis:
- GDT 500V 20% 20KA DIN RAIL
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12043 Pieces
- Datový list:
- 2817987.pdf
Úvod
BYCHIPS je distribuční odrůda pro 2817987, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 2817987 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - DC Spark Over (nom): | 500V |
|---|---|
| Tolerance: | ±20% |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | Module, Terminal Block |
| Ostatní jména: | 277-7206 2817987-ND F-MS 12 F-MS12 |
| Počet pólů: | 2 |
| Typ montáže: | DIN Rail |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 3 Weeks |
| Výrobní číslo výrobce: | 2817987 |
| Impulsní výbojový proud (8 / 20μs): | 20000A (20kA) |
| selhání Short: | No |
| Rozšířený popis: | Gas Discharge Tube 20000A (20kA) ±20% 2 Pole DIN Rail |
| Popis: | GDT 500V 20% 20KA DIN RAIL |
| Email: | [email protected] |
Související díly pro 2817987
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2817974 | Phoenix Contact | GDT 500V 20% 20KA DIN RAIL | Dotaz |
 |
2035-35-BT1LF | Bourns Inc. | GDT 350V 15% 5KA THROUGH HOLE | Dotaz |
 |
B88069X2261B252 | EPCOS (TDK) | GDT 90V 20% 10KA THROUGH HOLE | Dotaz |
 |
SL1411A230A | Littelfuse Inc. | GDT 230V 10KA THROUGH HOLE | Dotaz |
 |
2817990 | Phoenix Contact | GDT 500V 20% 20KA DIN RAIL | Dotaz |
 |
SL1021B090C | Littelfuse Inc. | GDT 90V 20KA | Dotaz |
 |
B88069X590S102 | EPCOS (TDK) | GDT 350V 20% 2.5KA THROUGH HOLE | Dotaz |
 |
B88069X0240S102 | EPCOS (TDK) | GAS DISCHARGE TUBE | Dotaz |
|
B88069X9070B502 | EPCOS (TDK) | T87-C600X | Dotaz |
 |
2015-23-SMH-RPLF | Bourns Inc. | GDT 230V 20% 5KA SURFACE MOUNT | Dotaz |
|
SL1024B400R | Littelfuse Inc. | GDT 400V 20KA THROUGH HOLE | Dotaz |
 |
2045-07-BT1LF | Bourns Inc. | GDT 75V 30% 10KA THROUGH HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers